⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1892678 | 0.97 | — | — | |
| Ammonia Solution, Strong SCHEMBL1503479 | 0.94 | — | — | |
| Acetic Acid SCHEMBL27398767 | 0.86 | FFAR3 (0.37) | — | |
| SCHEMBL27363206 | 0.75 | — | — | |
| SCHEMBL10040252 | 0.73 | CA2 (0.50) | — | |
| SCHEMBL1687008 | 0.71 | — | — | |
| SCHEMBL1503485 | 0.71 | — | — | |
| SCHEMBL595425 | 0.69 | CA5A (0.36) | — | |
| Methoxymethane SCHEMBL27799236 | 0.69 | — | — | |
| SCHEMBL1892675 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024237073-A1 | SILICA FINE PARTICLE DISPERSION FOR POLISHING, COMPOSITION FOR POLISHING, AND METHOD FOR PRODUCING SILICA FINE PARTICLE DISPERSION FOR POLISHING | 日揮触媒化成株式会社 | 2024-11-21 | — | — | WO | disclosed |
| US-11891307-B2 | Silica-based particle dispersion and production method therefor | JGC CATALYSTS AND CHEMICALS LTD. (JP) | 2024-02-06 | — | — | US | disclosed |
| EP-3539926-B1 | CERIA COMPOSITE PARTICLE DISPERSION, METHOD FOR PRODUCING SAME, AND POLISHING ABRASIVE GRAIN DISPERSION COMPRISING CERIA COMPOSITE PARTICLE DISPERSION | JGC CATALYSTS & CHEMICALS LTD (JP) | 2023-07-12 | — | — | EP | disclosed |
| EP-3447790-B1 | SILICA-BASED COMPOSITE FINE PARTICLE DISPERSION AND METHOD FOR MANUFACTURING SAME | JGC CATALYSTS & CHEMICALS LTD (JP) | 2023-05-24 | — | — | EP | disclosed |
| CN-109937187-B | Cerium oxide-based composite microparticle dispersion, method for producing same, and abrasive particle dispersion for polishing containing cerium oxide-based composite microparticle dispersion | 日挥触媒化成株式会社 | 2022-08-09 | — | — | CN | disclosed |
| US-20220055908-A1 | SILICA-BASED PARTICLE DISPERSION AND PRODUCTION METHOD THEREFOR | JGC CATALYSTS AND CHEMICALS LTD. (JP) | 2022-02-24 | — | — | US | disclosed |
| CN-110177852-B | Polishing composition | 日挥触媒化成株式会社 | 2021-12-14 | — | — | CN | disclosed |
| US-11059997-B2 | Polishing composition | JGC CATALYSTS AND CHEMICALS LTD. (JP) | 2021-07-13 | — | — | US | disclosed |
| US-10920120-B2 | Ceria composite particle dispersion, method for producing same, and polishing abrasive grain dispersion comprising ceria composite particle dispersion | JGC CATALYSTS AND CHEMICALS LTD. (JP) | 2021-02-16 | — | — | US | disclosed |
| EP-3279142-B1 | SILICA-BASED COMPOSITE FINE-PARTICLE DISPERSION, METHOD FOR PRODUCING SAME, AND POLISHING SLURRY INCLUDING SILICA-BASED COMPOSITE FINE-PARTICLE DISPERSION | JGC CATALYSTS & CHEMICALS LTD (JP) | 2021-01-06 | — | — | EP | disclosed |
| US-20060075688-A1 | Polishing composition and method of polishing with the same | FUJI PHOTO FILM CO., LTD. | 2006-04-13 | — | — | US | disclosed |
| EP-1642949-A1 | Polishing composition and method of polishing with the same | Fuji Photo Film Co., Ltd. (JP) | 2006-04-05 | — | — | EP | disclosed |
| US-20050191823-A1 | Polishing composition and polishing method | FUJIMI INCORPORATED (JP) | 2005-09-01 | — | — | US | disclosed |
| EP-1568746-A1 | Polishing composition and polishing method | FUJIMI INCORPORATED (JP) | 2005-08-31 | — | — | EP | disclosed |
| US-6899821-B2 | Abrasive liquid for metal and method for polishing | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2005-05-31 | — | — | US | disclosed |
| US-6896825-B1 | Abrasive liquid for metal and method for polishing | HITACHI CHEMICAL COMPANY, LTD (JP) | 2005-05-24 | — | — | US | disclosed |
| US-20050095860-A1 | Abrasive liquid for metal and method for polishing | RENESAS ELECTRONICS CORPORATION (JP) | 2005-05-05 | — | — | US | disclosed |
| US-20020017630-A1 | Abrasive liquid for metal and method for polishing | RENESAS ELECTRONICS CORPORATION (JP) | 2002-02-14 | — | — | US | disclosed |
| EP-1150341-A1 | MATERIALS FOR POLISHING LIQUID FOR METAL, POLISHING LIQUID FOR METAL, METHOD FOR PREPARATION THEREOF AND POLISHING METHOD USING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-10-31 | — | — | EP | disclosed |
| EP-1137056-A1 | ABRASIVE LIQUID FOR METAL AND METHOD FOR POLISHING | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-09-26 | — | — | EP | disclosed |