SCHEMBL7174157

SCHEMBL7174157

CCCCC(CCCC)C(=O)CC(N)=O

nearest known ligand 0.57

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
CA2 P00918 7/20 0.57
CA1 P00915 4/20 0.57
MAPK1 P28482 1/20 0.48
SLC1A2 P43004 2/20 0.46
SLC1A1 P43005 2/20 0.46
SLC1A3 P43003 1/20 0.46
DPP7 Q9UHL4 3/20 0.40
GRIK1 P39086 2/20 0.40
GRIK2 Q13002 2/20 0.40
SLC15A1 P46059 1/20 0.40
METAP1 P53582 1/20 0.40
L3MBTL1 Q9Y468 1/20 0.37
DPP8 Q6V1X1 2/20 0.37
DPP4 P27487 1/20 0.37
DPP9 Q86TI2 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12611363 0.86 HDAC7 (0.48) CA2CA1SLC1A2SLC1A1SLC1A3
SCHEMBL29153274 0.82 CA2 (0.64) CA2CA1MAPK1SLC1A2SLC1A1
SCHEMBL20680316 0.81 CA2 (0.47) CA2CA1MAPK1SLC1A2SLC1A1
SCHEMBL10280928 0.81 CA1 (0.45) CA2CA1MAPK1SLC1A2SLC1A1
SCHEMBL6827612 0.80 CA2 (0.56) CA2CA1MAPK1SLC1A2SLC1A1
Hydrochloric Acid SCHEMBL3023637 0.79 CA2 (0.78) CA2CA1MAPK1SLC1A2SLC1A1
SCHEMBL3964956 0.77 CA2 (0.57) CA2CA1MAPK1SLC1A2SLC1A1
SCHEMBL30426183 0.77 CA2 (0.53) CA2CA1MAPK1SLC1A2SLC1A1
SCHEMBL28752344 0.77 CA2 (0.56) CA2CA1MAPK1SLC1A2SLC1A1
SCHEMBL2369450 0.77 CA2 (0.82) CA2CA1MAPK1SLC1A2SLC1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260088410-A1 ELECTRONICS ASSEMBLY HAVING ELECTROCHEMICALLY DEBONDABLE COMPONENTS HENKEL AG & CO KGAA (DE) 2026-03-26 US disclosed
US-12540262-B2 Two component (2K) curable adhesive composition HENKEL AG & CO. KGAA (DE) 2026-02-03 US disclosed
WO-2025119646-A1 BONDED STRUCTURE COMPRISING AN ELECTROCHEMICALLY DEBONDABLE ADHESIVE HENKEL AG & CO. KGAA (DE) 2025-06-12 WO disclosed
EP-4566808-A1 BONDED STRUCTURE COMPRISING AN ELECTROCHEMICALLY DEBONDABLE ADHESIVE Henkel AG & Co. KGaA (DE) 2025-06-11 EP disclosed
WO-2025093205-A1 TWO COMPONENT (2K) CURABLE AND DEBONDABLE ADHESIVE COMPOSITION HENKEL AG & CO. KGAA (DE) 2025-05-08 WO disclosed
EP-4540296-A1 TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION Henkel AG & Co. KGaA (DE) 2025-04-23 EP disclosed
US-20250115788-A1 TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION HENKEL AG & CO KGAA (DE) 2025-04-10 US disclosed
WO-2024260662-A1 ELECTRONICS ASSEMBLY HAVING ELECTROCHEMICALLY DEBONDABLE COMPONENTS HENKEL AG & CO. KGAA (DE) 2024-12-26 WO disclosed
EP-4481913-A1 ELECTRONICS ASSEMBLY HAVING ELECTROCHEMICALLY DEBONDABLE COMPONENTS Henkel AG & Co. KGaA (DE) 2024-12-25 EP disclosed
WO-2023241875-A1 TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION HENKEL AG & CO. KGAA (DE) 2023-12-21 WO disclosed
EP-2688949-A1 ACCELERATOR FOR CURING RESINS Akzo Nobel Chemicals International B.V. (NL) 2014-01-29 EP disclosed
EP-2688947-A1 ACCELERATOR FOR CURING RESINS Akzo Nobel Chemicals International B.V. (NL) 2014-01-29 EP disclosed
US-20140005342-A1 ACCELERATOR FOR CURING RESINS NOURYON CHEMICALS INTERNATIONAL B.V. (NL) 2014-01-02 US disclosed
US-20140005343-A1 ACCELERATOR FOR CURING RESINS AKZO NOBEL CHEMICALS INTERNATIONAL B.V. (NL) 2014-01-02 US disclosed
EP-2626383-A1 Accelerator for curing resins Akzo Nobel Chemicals International B.V. (NL) 2013-08-14 EP disclosed
WO-2013079563-A1 DUAL CURE SYSTEM AKZO NOBEL CHEMICALS INTERNATIONAL B.V. (NL) 2013-06-06 WO disclosed
WO-2012126919-A1 PROCESS FOR THE PREPARATION OF AN ACCELERATOR SOLUTION AKZO NOBEL CHEMICALS INTERNATIONAL B.V. (NL) 2012-09-27 WO disclosed
WO-2012126918-A1 ACCELERATOR FOR CURING RESINS AKZO NOBEL CHEMICALS INTERNATIONAL B.V. (NL) 2012-09-27 WO disclosed
WO-2012126917-A1 ACCELERATOR FOR CURING RESINS AKZO NOBEL CHEMICALS INTERNATIONAL B.V. (NL) 2012-09-27 WO disclosed
WO-2003082978-A1 COLD CURABLE RESIN COMPOSITION, CURING METHOD OF THE RESIN COMPOSITION AND CURED PRODUCT OF THE RESIN COMPOSITION DJK LABORATORIES INC. (JP) 2003-10-09 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12540262-B2 Two component (2K) curable adhesive composition ILK, MAT2A, MMAB CA2 1124/4885CA1 1692/4885MAPK1 1872/4885
US-20260088410-A1 ELECTRONICS ASSEMBLY HAVING ELECTROCHEMICALLY DEBONDABLE COMPONENTS EPCAM, CDH1, ITGA4 CA2 1889/4885CA1 536/4885MAPK1 2512/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.