SCHEMBL7196792

SCHEMBL7196792

O=C(Nc1ccc(O)cc1)n1nnc2ccccc21

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RPS6KA3 P51812 1/20 0.54
KMT2A Q03164 4/20 0.52
ALDH1A1 P00352 3/20 0.52
MEN1 O00255 1/20 0.52
MGAM O43451 6/20 0.51
AMY1A P0DUB6 6/20 0.51
GAA P10253 6/20 0.51
SI P14410 6/20 0.51
MGAM2 Q2M2H8 6/20 0.51
F2 P00734 1/20 0.51
HPGD P15428 1/20 0.51
SLC9A1 P19634 1/20 0.51
KCNMA1 Q12791 1/20 0.51
ASAH1 Q13510 2/20 0.50
MGLL Q99685 1/20 0.49
DGAT1 O75907 1/20 0.49
RAB9A P51151 2/20 0.47
NPC1 O15118 1/20 0.47
F12 P00748 3/20 0.47
LMNA P02545 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL426720 0.89 GAA (0.59) KMT2AALDH1A1MEN1MGAMAMY1A
SCHEMBL7901101 0.87 RAB9A (0.62) KMT2AALDH1A1MEN1MGAMAMY1A
SCHEMBL425448 0.87 GAA (0.54) KMT2AALDH1A1MEN1MGAMAMY1A
SCHEMBL424346 0.87 F12 (0.63) KMT2AALDH1A1MEN1MGAMAMY1A
SCHEMBL425567 0.83 F12 (0.66) KMT2AALDH1A1MEN1MGAMAMY1A
SCHEMBL425439 0.83 MGLL (0.53) KMT2AALDH1A1MEN1MGAMAMY1A
SCHEMBL17875212 0.76 ASAH1 (0.59) KMT2AALDH1A1MGAMAMY1AGAA
SCHEMBL9419551 0.76 MGAM (0.58) KMT2AALDH1A1MGAMAMY1AGAA
SCHEMBL706083 0.73 MGAM (0.68) KMT2AALDH1A1MGAMAMY1AGAA
SCHEMBL4250719 0.73 GAA (0.68) KMT2AALDH1A1MGAMAMY1AGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20020161151-A1 Water-soluble polymeric adhesion promoter and production method SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-10-31 US claimed
US-6455654-B1 Water-soluble polymeric adhesion promoter and production method SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-09-24 US claimed
US-20020035222-A1 Water-soluble polymeric adhesion promoter and production method SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-03-21 US claimed
US-6531564-B2 Corrosion resistance; bonding strength SAMSUNG ELECTRONICS CO., LTD. (KR) 2003-03-11 US disclosed
US-20020161151-A1 Water-soluble polymeric adhesion promoter and production method SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-10-31 US disclosed
US-6455654-B1 Water-soluble polymeric adhesion promoter and production method SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-09-24 US disclosed
US-20020035222-A1 Water-soluble polymeric adhesion promoter and production method SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-03-21 US disclosed