SCHEMBL468709

SCHEMBL468709

Cn1c(-c2ccccc2)nc(Cc2ccccc2)c1O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LTB4R Q15722 3/20 0.46
NR1H2 P55055 2/20 0.44
NR1H3 Q13133 2/20 0.44
ABCB1 P08183 1/20 0.43
MAOA P21397 1/20 0.43
HPGD P15428 1/20 0.41
PTGER1 P34995 1/20 0.40
EGLN1 Q9GZT9 1/20 0.40
MEN1 O00255 1/20 0.40
NPC1 O15118 1/20 0.40
KMT2A Q03164 1/20 0.40
HDAC6 Q9UBN7 1/20 0.39
HSD11B1 P28845 1/20 0.39
ATM Q13315 1/20 0.39
CYP1A2 P05177 1/20 0.39
CYP3A4 P08684 1/20 0.39
CYP2D6 P10635 1/20 0.39
CYP2C9 P11712 1/20 0.39
CYP2C19 P33261 1/20 0.39
HRH1 P35367 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27763769 0.86 ALDH1A1 (0.49) HPGDMEN1NPC1KMT2AHSD11B1
SCHEMBL719704 0.75 CYP1A2 (0.46) NR1H2NR1H3HPGDPTGER1MEN1
SCHEMBL33657 0.75 ATM (0.45) NR1H2NR1H3PTGER1MEN1NPC1
SCHEMBL8989106 0.71 ATM (0.41) NR1H2NR1H3HPGDNPC1ATM
SCHEMBL5200829 0.70 CYP1A2 (0.41) NR1H2NR1H3HPGDPTGER1NPC1
SCHEMBL18770499 0.70 AADAT (0.42) LTB4RNR1H2NR1H3NPC1CYP1A2
SCHEMBL25121068 0.69 ADORA2B (0.47) HPGDKMT2ACYP2C9ADORA2AADORA2B
SCHEMBL3627522 0.68 ATM (0.45) NR1H2NR1H3MEN1NPC1KMT2A
SCHEMBL27775985 0.68 RXFP1 (0.48) LTB4RHPGDNPC1KMT2ACYP2C9
SCHEMBL27867318 0.68 LTB4R (0.50) LTB4RMEN1KMT2ACYP1A2CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 139 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110234718-A Wear-resistant coating composition with inorganic metal oxide 莫门蒂夫性能材料股份有限公司 2019-09-13 CN claimed
CN-103665760-A Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit board SAMSUNG ELECTRO MECH 2014-03-26 CN claimed
CN-113480958-B Special dual-curing epoxy adhesive for automobile camera AA (acrylic acid) manufacturing process, preparation method and application 顺德职业技术学院 2022-12-09 CN disclosed
CN-108699219-B Blends for curing epoxy resin compositions 亨斯迈石油化学有限责任公司 2022-04-15 CN disclosed
US-11198756-B2 Blend for curing epoxy resin composistions HUNTSMAN PETROCHEMICAL LLC (US) 2021-12-14 US disclosed
EP-3472221-B1 BLEND FOR CURING EPOXY RESIN COMPOSITIONS HUNTSMAN PETROCHEMICAL LLC (US) 2021-11-10 EP disclosed
US-10662304-B2 Composites for protecting signal transmitters/receivers SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION (US) 2020-05-26 US disclosed
CN-110392709-A Use the epoxy resin of metal nanoparticle and nitrogenous catalyst stabilization and method 3M创新有限公司 2019-10-29 CN disclosed
EP-3548574-A1 ABRASION RESISTANT COATING COMPOSITION WITH INORGANIC METAL OXIDES Momentive Performance Materials Inc. (US) 2019-10-09 EP disclosed
CN-110234718-A Wear-resistant coating composition with inorganic metal oxide 莫门蒂夫性能材料股份有限公司 2019-09-13 CN disclosed
CN-110072907-A Epoxy-stabilized is realized using substituted barbiturates 3M创新有限公司 2019-07-30 CN disclosed
CN-1325429-A Bendable articles containing aheating element, assemblies made therewith, and a method of using said articles 3M INNOVATIVE PROPERTIES CO (US) 2001-12-05 CN disclosed
CN-1071353-C Melt-flowable materials and method of sealing surfaces MINNESOTA MINING & MFG (US) 2001-09-19 CN disclosed
CN-1288481-A Curable epoxy-based compositions LOCTITE R & D LTD (IE) 2001-03-21 CN disclosed
CN-1285783-A Sealant composition, article containing same and method of use thereof MINNESOTA MINING & MFG (US) 2001-02-28 CN disclosed
CN-1047399-C Topographical method MINNESOTA MINING & MFG (US) 1999-12-15 CN disclosed
EP-0766908-B1 METHOD AND DEVICE FOR COATING PRINTED-CIRCUIT BOARDS, IN PARTICULAR FOR THE MANUFACTURE OF MULTI-CHIP-MODULES SCHAEFER HANS JUERGEN (DE) 1998-12-16 EP disclosed
CN-1036693-C Method for forming tin solder durable figures with photosensitive thermosetting resin composition TAIYO INK MFG CO LTD (JP) 1997-12-10 CN disclosed
CN-1134715-A Melt flowable material and method of surface sealing MINNESOTA MINING & MFG (US) 1996-10-30 CN disclosed
CN-1134718-A Topographical method MINNESOTA MINING & MFG (US) 1996-10-30 CN disclosed