Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.45 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.43 |
| ▸ | EHMT2 | Q96KQ7 | 1/20 | 0.42 |
| ▸ | EHMT1 | Q9H9B1 | 1/20 | 0.42 |
| ▸ | APOBEC3G | Q9HC16 | 1/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.37 |
| ▸ | NAPRT | Q6XQN6 | 1/20 | 0.37 |
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.37 |
| ▸ | TSHR | P16473 | 2/20 | 0.36 |
| ▸ | BAZ2B | Q9UIF8 | 1/20 | 0.36 |
| ▸ | ADORA3 | P0DMS8 | 1/20 | 0.36 |
| ▸ | MC4R | P32245 | 1/20 | 0.36 |
| ▸ | ADRA1A | P35348 | 1/20 | 0.36 |
| ▸ | MC3R | P41968 | 1/20 | 0.36 |
| ▸ | NISCH | Q9Y2I1 | 1/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | POLB | P06746 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22327277 | 0.85 | — | — | |
| SCHEMBL15516303 | 0.82 | LMNA (0.45) | LMNAHSP90AA1EHMT2EHMT1APOBEC3G | |
| SCHEMBL9252715 | 0.78 | — | — | |
| SCHEMBL28006477 | 0.78 | — | — | |
| SCHEMBL1617422 | 0.78 | — | — | |
| SCHEMBL8083497 | 0.78 | — | — | |
| SCHEMBL28046675 | 0.76 | LMNA (0.41) | LMNAHSP90AA1KDM4ENAPRTHCAR2 | |
| SCHEMBL4156992 | 0.73 | L3MBTL1 (0.40) | LMNAHSP90AA1TSHRSMN1; SMN2 | |
| SCHEMBL4837646 | 0.72 | — | — | |
| SCHEMBL11611749 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11939691-B2 | Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath | ISHIHARA CHEMICAL CO., LTD. (JP) | 2024-03-26 | — | — | US | disclosed |
| CN-104448700-A | Resin composition | AJINOMOTO KK | 2015-03-25 | — | — | CN | disclosed |
| US-6607653-B1 | Tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the alloy with | DAIWA FINE CHEMICALS CO., LTD. (JP) | 2003-08-19 | — | — | US | disclosed |
| US-3937718-A | CARBOXYLIC ACIDS, ALCOHOLS, TERTIERY PHOSPHINES, DISULFIDES, SULFENIC ACID ESTER | SANKYO COMPANY LIMITED (JA) | 1976-02-10 | — | — | US | disclosed |