Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KCNN4 | O15554 | 1/20 | 0.46 |
| ▸ | PDK2 | Q15119 | 2/20 | 0.46 |
| ▸ | IDO1 | P14902 | 2/20 | 0.40 |
| ▸ | CDK2 | P24941 | 1/20 | 0.40 |
| ▸ | GSK3B | P49841 | 1/20 | 0.40 |
| ▸ | ATR | Q13535 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.37 |
| ▸ | MAPT | P10636 | 2/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.37 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.37 |
| ▸ | RAB9A | P51151 | 2/20 | 0.37 |
| ▸ | MAP2K7 | O14733 | 1/20 | 0.37 |
| ▸ | GMNN | O75496 | 1/20 | 0.37 |
| ▸ | LMNA | P02545 | 1/20 | 0.37 |
| ▸ | TP53 | P04637 | 1/20 | 0.37 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.37 |
| ▸ | POLB | P06746 | 1/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.37 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.37 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20878106 | 0.91 | KCNN4 (0.42) | KCNN4PDK2CDK2GSK3BALDH1A1 | |
| SCHEMBL13176996 | 0.89 | FFAR1 (0.47) | KCNN4PDK2CDK2GSK3BALDH1A1 | |
| SCHEMBL8732576 | 0.87 | KCNN4 (0.54) | KCNN4PDK2IDO1CDK2GSK3B | |
| SCHEMBL29788053 | 0.86 | DPP4 (0.54) | KCNN4PDK2ATRDPP4KMT2A | |
| SCHEMBL792032 | 0.86 | DPP4 (0.54) | KCNN4PDK2ATRDPP4KMT2A | |
| SCHEMBL648491 | 0.86 | IDO1 (0.44) | PDK2IDO1ALDH1A1MAPTTDP1 | |
| SCHEMBL1338590 | 0.81 | FFAR1 (0.46) | KCNN4PDK2IDO1DPP4 | |
| SCHEMBL4453918 | 0.81 | ABL1 (0.51) | KCNN4PDK2DPP4KMT2A | |
| SCHEMBL19320834 | 0.81 | MAPK1 (0.56) | ALDH1A1RAB9ATP53CYP3A4CYP2C9 | |
| SCHEMBL30296338 | 0.80 | CA1 (0.42) | KCNN4PDK2CYP2C9 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 414 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230236508-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM AND SEMICONDUCTOR ELEMENT | RESONAC CORPORATION (JP) | 2023-07-27 | — | — | US | claimed |
| EP-4099090-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM AND SEMICONDUCTOR ELEMENT | Showa Denko Materials Co., Ltd. (JP) | 2022-12-07 | — | — | EP | claimed |
| US-5945501-A | Epoxy resin compositions including novel phenol novolak condensates produced from bis(methoxymethyl)biphenyls | UBE INDUSTRIES, LTD. (JP) | 1999-08-31 | — | — | US | claimed |
| US-5612442-A | Phenol novolak condensate and bis(methoxymethyl)biphenyl for production thereof | UBE INDUSTRIES, LTD. (JP) | 1997-03-18 | — | — | US | claimed |
| JP-8143648-A | — | — | None | — | — | JP | disclosed |
| JP-8291099-A | — | — | None | — | — | JP | disclosed |
| US-20260146153-A1 | RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE | RESONAC CORPORATION (JP) | 2026-05-28 | — | — | US | disclosed |
| WO-2026105609-A1 | COMPOSITION, LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 東レ株式会社 | 2026-05-21 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260098149-A1 | RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE | RESONAC CORPORATION (JP) | 2026-04-09 | — | — | US | disclosed |
| US-12588548-B2 | Resin composition for semiconductor sealing, underfill material, mold resin, and semiconductor package | SEKISUI KASEI CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| EP-4317237-B1 | RESIN COMPOSITION FOR ENCAPSULATING AND ELECTRONIC DEVICE USING SAME | SUMITOMO BAKELITE CO (JP) | 2026-03-11 | — | — | EP | disclosed |
| US-5945501-A | Epoxy resin compositions including novel phenol novolak condensates produced from bis(methoxymethyl)biphenyls | UBE INDUSTRIES, LTD. (JP) | 1999-08-31 | — | — | US | disclosed |
| US-5945501-A | Epoxy resin compositions including novel phenol novolak condensates produced from bis(methoxymethyl)biphenyls | UBE INDUSTRIES, LTD. (JP) | 1999-08-31 | — | — | US | disclosed |
| US-5945501-A | Epoxy resin compositions including novel phenol novolak condensates produced from bis(methoxymethyl)biphenyls | UBE INDUSTRIES, LTD. (JP) | 1999-08-31 | — | — | US | disclosed |
| US-5612442-A | Phenol novolak condensate and bis(methoxymethyl)biphenyl for production thereof | UBE INDUSTRIES, LTD. (JP) | 1997-03-18 | — | — | US | disclosed |
| US-5612442-A | Phenol novolak condensate and bis(methoxymethyl)biphenyl for production thereof | UBE INDUSTRIES, LTD. (JP) | 1997-03-18 | — | — | US | disclosed |
| US-5612442-A | Phenol novolak condensate and bis(methoxymethyl)biphenyl for production thereof | UBE INDUSTRIES, LTD. (JP) | 1997-03-18 | — | — | US | disclosed |
| JP-H08291099-A | BIS(METHOXYMETHYL)BIPHENYL AND ITS PRODUCTION | UBE IND LTD | 1996-11-05 | — | — | JP | disclosed |
| JP-H08143648-A | NEW PHENOLIC NOVOLAK CONDENSATE | MEIWA KASEI KK | 1996-06-04 | — | — | JP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | KCNN4 1525/4885PDK2 4601/4885IDO1 2906/4885 |
| US-20260098149-A1 | RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE | SEM1, MEP1A, RER1 | KCNN4 2598/4885PDK2 4313/4885IDO1 3167/4885 |
| US-12588548-B2 | Resin composition for semiconductor sealing, underfill material, mold resin, and semiconductor package | SEM1, ASH2L, MARS1 | KCNN4 2819/4885PDK2 4752/4885IDO1 1977/4885 |
| US-20260146153-A1 | RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE | MYB, EED, RPS27L | KCNN4 4460/4885PDK2 2905/4885IDO1 2924/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.