SCHEMBL756616

SCHEMBL756616

Cc1c(C(=O)O)c(C(=O)O)cc(C(=O)O)c1C(=O)O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 4/20 0.45
KMT2A Q03164 2/20 0.45
MEN1 O00255 1/20 0.45
TDP1 Q9NUW8 1/20 0.45
LDHA P00338 2/20 0.42
LDHB P07195 2/20 0.42
CSNK2A1 P68400 1/20 0.41
CYP3A4 P08684 1/20 0.41
ACHE P22303 1/20 0.41
NOTUM Q6P988 2/20 0.41
GPR35 Q9HC97 1/20 0.39
ALDH1A1 P00352 3/20 0.39
GAA P10253 1/20 0.39
HPGD P15428 1/20 0.39
HSD17B10 Q99714 1/20 0.39
MAPK1 P28482 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
TPMT P51580 1/20 0.39
POLB P06746 1/20 0.38
HMGB1 P09429 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14989172 0.90 KDM4E (0.47) KDM4EKMT2AMEN1TDP1LDHA
SCHEMBL31373145 0.90 KDM4E (0.47) KDM4EKMT2AMEN1TDP1LDHA
SCHEMBL3030086 0.88 CYP3A4 (0.47) KDM4EKMT2AMEN1TDP1LDHA
SCHEMBL29927238 0.88 CYP3A4 (0.47) KDM4EKMT2AMEN1TDP1LDHA
SCHEMBL32665463 0.85 LDHA (0.48) KDM4EKMT2AMEN1TDP1LDHA
SCHEMBL14989153 0.84 KDM4E (0.50) KDM4EKMT2AMEN1TDP1LDHA
SCHEMBL28201473 0.84 AKR1C3 (0.57) KDM4ETDP1ALDH1A1HSD17B10POLB
SCHEMBL10663487 0.83 KDM4E (0.44) KDM4EKMT2AMEN1TDP1LDHA
SCHEMBL15750580 0.82 MEN1 (0.40) KDM4EKMT2AMEN1TDP1CYP3A4
SCHEMBL30436363 0.82 MEN1 (0.40) KDM4EKMT2AMEN1TDP1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 214 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1567470-B1 HYDROGENATION OF BENZENE POLYCARBOXYLIC ACIDS OR DERIVATIVES THEREOF EXXONMOBIL CHEM PATENTS INC (US) 2013-06-05 EP claimed
EP-0103922-A1 Self-extinguishing polycarbonate composition ENICHEM TECNORESINE S.p.A. (IT) 1984-03-28 EP claimed
JP-11012357-A None JP disclosed
US-12630675-B2 Polyimide resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-05-19 US disclosed
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-12584015-B2 Polyimide resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-03-24 US disclosed
US-12577399-B2 Resin composition, resin molded article and method for producing same MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-03-17 US disclosed
US-20260015501-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED PRODUCT, METAL FOIL LAMINATED BOARD, BONDING SHEET, FILAMENT, AND MATERIAL FOR THREE-DIMENSIONAL FABRICATION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-01-15 US disclosed
US-20250388735-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED BODY, AND CONSTITUTING MEMBER OF IC SOCKET FOR INSPECTION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-12-25 US disclosed
EP-3936571-B1 FLAME-RETARDANT POLYIMIDE MOLDING MATERIAL AND MOLDED OBJECT MITSUBISHI GAS CHEMICAL CO (JP) 2025-12-17 EP disclosed
EP-3940017-B1 POLYIMIDE RESIN COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2025-12-03 EP disclosed
EP-0361462-A2 Process for producing copper or silver/polyimide composite article HITACHI, LTD. (JP) 1990-04-04 EP disclosed
EP-0361461-A2 Process for producing metal-polyimide composite article HITACHI, LTD. (JP) 1990-04-04 EP disclosed
US-4792476-A AROMATIC POLYIMIDES HITACHI, LTD. (JP) 1988-12-20 US disclosed
US-4690999-A MOLECULARLY-ORIENTED POLYIMIDES BASED ON PARA-AROMATIC DIAMINES; FILMS; PROTECTIVE COATINGS; INTEGRATED CIRCUITS HITACHI, LTD. (JP) 1987-09-01 US disclosed
EP-0099079-B1 CO-VULCANIZABLE COMPOSITIONS BASED ON FLUOROELASTOMERS AND POLYMERIC COMPOUNDS WITH A PERFLUOROETHERIC STRUCTURE AUSIMONT S.p.A. (IT) 1987-05-13 EP disclosed
US-4530969-A Vulcanized with peroxides MONTEDISON S.P.A. (IT) 1985-07-23 US disclosed
EP-0133533-A2 Low thermal expansion resin material for a wiring insulating film. HITACHI, LTD. (JP) 1985-02-27 EP disclosed
EP-0103922-A1 Self-extinguishing polycarbonate composition ENICHEM TECNORESINE S.p.A. (IT) 1984-03-28 EP disclosed
EP-0099079-A1 Co-vulcanizable compositions based on fluoroelastomers and polymeric compounds with a perfluoroetheric structure AUSIMONT S.p.A. (IT) 1984-01-25 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (5 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12577399-B2 Resin composition, resin molded article and method for producing same SEM1, WDR1, RER1 KDM4E 1354/4885KMT2A 624/4885MEN1 1721/4885
US-12630675-B2 Polyimide resin composition SOD1, AOC2, GPX1 KDM4E 2696/4885KMT2A 1657/4885MEN1 2058/4885
US-12584015-B2 Polyimide resin composition PSMA1, SEM1, RIF1 KDM4E 1152/4885KMT2A 1184/4885MEN1 3169/4885
US-20250388735-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED BODY, AND CONSTITUTING MEMBER OF IC SOCKET FOR INSPECTION TAS1R1, PBRM1, TAF1 KDM4E 490/4885KMT2A 1536/4885MEN1 1674/4885
US-20260015501-A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED PRODUCT, METAL FOIL LAMINATED BOARD, BONDING SHEET, FILAMENT, AND MATERIAL FOR THREE-DIMENSIONAL FABRICATION TRA2B, TERB1, MALT1 KDM4E 244/4885KMT2A 105/4885MEN1 1065/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.