SCHEMBL756876

SCHEMBL756876

Cc1ccc(O)cc1-c1ccc(O)c(O)c1O

nearest known ligand 0.50

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TTR P02766 1/20 0.44
ESR2 Q92731 9/20 0.41
ESR1 P03372 8/20 0.41
ELANE P08246 1/20 0.40
ACHE P22303 1/20 0.39
MAOA P21397 1/20 0.39
UGT1A1 P22309 1/20 0.39
MAOB P27338 1/20 0.39
AMY1A P0DUB6 1/20 0.38
ALDH1A1 P00352 2/20 0.38
GAA P10253 2/20 0.38
MAPT P10636 1/20 0.38
HPGD P15428 1/20 0.38
HTT P42858 1/20 0.38
RUNX1 Q01196 1/20 0.38
CBFB Q13951 1/20 0.38
ANPEP P15144 1/20 0.38
DPP4 P27487 1/20 0.38
PKM P14618 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29623219 0.86 ESR2 (0.57) TTRESR2ESR1ALDH1A1MAPT
SCHEMBL16196612 0.86 ESR2 (0.57) TTRESR2ESR1ALDH1A1MAPT
SCHEMBL8059881 0.82 ACHE (0.52) ESR2ESR1ACHEMAOAUGT1A1
SCHEMBL29861377 0.81 ALOX5 (0.48) TTRESR2ESR1MAOAUGT1A1
SCHEMBL16196432 0.81 ALOX5 (0.48) TTRESR2ESR1MAOAUGT1A1
SCHEMBL28487296 0.76 TTR (0.44) TTRESR2ESR1MAOAUGT1A1
SCHEMBL15512030 0.75 KDM4E (0.39) ESR2ESR1ELANEMAOAALDH1A1
SCHEMBL2870993 0.75 TRPA1 (0.48) ESR2ESR1ELANEACHEMAOA
SCHEMBL29737462 0.75 ALDH1A1 (0.44) TTRMAOAAMY1AALDH1A1MAPT
SCHEMBL1883019 0.75 ALDH1A1 (0.44) TTRMAOAAMY1AALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117939914-A Structure, display element, pattern for partition wall, and method for forming the same 东京应化工业株式会社 2024-04-26 CN disclosed
CN-111205648-B Curable composition, cured product, microlens, and optical element 东京应化工业株式会社 2023-12-08 CN disclosed
CN-111324013-B Chemically amplified positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2023-12-01 CN disclosed
CN-117106358-A Composition for forming separation layer, support substrate with separation layer, laminate, method for producing laminate, and method for producing electronic component 东京应化工业株式会社 2023-11-24 CN disclosed
CN-111381438-B Chemically amplified positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2023-06-20 CN disclosed
CN-116262863-A Composition for forming separation layer, support substrate with separation layer, laminate, method for producing laminate, and method for producing electronic component 东京应化工业株式会社 2023-06-16 CN disclosed
CN-109062007-B Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2023-03-10 CN disclosed
CN-106933034-B Positive photoresist composition 东京应化工业株式会社 2023-01-06 CN disclosed
CN-115437214-A Chemically amplified positive photosensitive resin composition, protective film, and element having protective film 奇美实业股份有限公司 2022-12-06 CN disclosed
CN-108693710-B Positive photosensitive polysiloxane composition 奇美实业股份有限公司 2022-12-02 CN disclosed
US-9389509-B2 Photosensitive polysiloxane composition, protecting film and element having the protecting film CHI MEI CORPORATION (TW) 2016-07-12 US disclosed
US-20150346601-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION, PROTECTIVE FILM AND ELEMENT HAVING THE PROTECTIVE FILM CHI MEI CORPORATION (TW) 2015-12-03 US disclosed
US-20150293449-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2015-10-15 US disclosed
US-20150234275-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION, PROTECTING FILM AND ELEMENT HAVING THE PROTECTING FILM CHI MEI CORPORATION (TW) 2015-08-20 US disclosed
US-20150050596-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2015-02-19 US disclosed
US-20150031808-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION AND USES THEREOF CHI MEI CORPORATION (TW) 2015-01-29 US disclosed
US-20140322651-A1 PHOTOSENSITIVE POLYSILOXANE COMPOSITION, PROTECTING FILM AND ELEMENT HAVING THE PROTECTING FILM CHI MEI CORPORATION (TW) 2014-10-30 US disclosed
US-20130144005-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2013-06-06 US disclosed
US-8349461-B2 Photo-curing polysiloxane composition and protective film formed from the same CHI MEI CORPORATION (TW) 2013-01-08 US disclosed
US-20120052439-A1 PHOTO-CURING POLYSILOXANE COMPOSITION AND PROTECTIVE FILM FORMED FROM THE SAME CHI MEI CORPORATION (TW) 2012-03-01 US disclosed