Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 4/20 | 0.43 |
| ▸ | CA2 | P00918 | 4/20 | 0.43 |
| ▸ | CA9 | Q16790 | 3/20 | 0.43 |
| ▸ | CA7 | P43166 | 2/20 | 0.43 |
| ▸ | CA12 | O43570 | 2/20 | 0.43 |
| ▸ | CA4 | P22748 | 1/20 | 0.43 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.36 |
| ▸ | TSHR | P16473 | 2/20 | 0.36 |
| ▸ | TP53 | P04637 | 1/20 | 0.36 |
| ▸ | ADRA2B | P18089 | 1/20 | 0.36 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.36 |
| ▸ | HTT | P42858 | 2/20 | 0.36 |
| ▸ | ORAI1 | Q96D31 | 2/20 | 0.36 |
| ▸ | ORAI2 | Q96SN7 | 2/20 | 0.36 |
| ▸ | ORAI3 | Q9BRQ5 | 2/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.35 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.35 |
| ▸ | ENPP2 | Q13822 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18124824 | 0.80 | CA1 (0.39) | CA1CA2CA9CA12ORAI1 | |
| SCHEMBL17940744 | 0.79 | CA1 (0.40) | CA1CA2CA9CA7CA12 | |
| SCHEMBL7860755 | 0.78 | CA1 (0.52) | CA1CA2CA9CA7CA12 | |
| SCHEMBL7591871 | 0.75 | ACHE (0.36) | CA1CA2CA9CA7CA12 | |
| SCHEMBL30237979 | 0.72 | CA1 (0.44) | CA1CA2CA9CA7CA12 | |
| SCHEMBL2774133 | 0.72 | CA1 (0.44) | CA1CA2CA9CA7CA12 | |
| SCHEMBL13714210 | 0.72 | CA12 (0.32) | CA1CA2CA9CA12 | |
| SCHEMBL17236446 | 0.71 | CA2 (0.37) | CA1CA2CA9CA12CA4 | |
| SCHEMBL10018676 | 0.71 | CA1 (0.33) | CA1CA2CA9CA12ALDH1A1 | |
| SCHEMBL7590437 | 0.71 | TSHR (0.36) | CA1CA2CA9CA12ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11754926-B2 | Method of forming resist pattern, resist composition and method of producing the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-09-12 | — | — | US | disclosed |
| US-11754926-B2 | Method of forming resist pattern, resist composition and method of producing the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-09-12 | — | — | US | disclosed |
| US-20230273521-A1 | CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-08-31 | — | — | US | disclosed |
| US-20230273521-A1 | CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-08-31 | — | — | US | disclosed |
| US-20230229084-A1 | CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-07-20 | — | — | US | disclosed |
| US-20230127914-A1 | RESIST PATTERN FORMATION METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-04-27 | — | — | US | disclosed |
| US-20230127914-A1 | RESIST PATTERN FORMATION METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-04-27 | — | — | US | disclosed |
| US-20230004085-A1 | METHOD FOR MANUFACTURING CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PREMIX SOLUTION FOR PREPARING CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, METHOD FOR MANUFACTURING PHOTOSENSITIVE DRY FILM, AND METHOD FOR MANUFACTURING PATTERNED RESIST FILM | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-05 | — | — | US | disclosed |
| US-20210356863-A1 | CHEMICAL AMPLIFICATION-TYPE PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF PATTERNED RESIST LAYER, PRODUCTION METHOD OF PLATED MOLDED ARTICLE, COMPOUND, AND PRODUCTION METHOD OF COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-11-18 | — | — | US | disclosed |
| US-11131927-B2 | Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template and method of manufacturing plated article | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-09-28 | — | — | US | disclosed |
| US-11016387-B2 | Chemically amplified positive-type photosensitive resin composition, method of manufacturing substrate with template, and method of manufacturing plated article | TOKYO OHKA KOGYO CO., LTD. (JP) | 2021-05-25 | — | — | US | disclosed |
| US-20200209739-A1 | CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD OF MANUFACTURING PLATED ARTICLE, AND COMPOUND | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-07-02 | — | — | US | disclosed |
| US-20200150541-A1 | METHOD OF FORMING RESIST PATTERN, RESIST COMPOSITION AND METHOD OF PRODUCING THE SAME | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-05-14 | — | — | US | disclosed |
| US-20200033729-A1 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2020-01-30 | — | — | US | disclosed |
| US-20190346765-A1 | CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE AND METHOD OF MANUFACTURING PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-11-14 | — | — | US | disclosed |
| EP-0675118-B1 | Biphenylderivatives, process for their preparation and their use as medicaments | EISAI CO LTD (JP) | 2002-10-09 | — | — | EP | disclosed |
| US-6281214-B1 | USEFUL FOR TREATING AND AMELIORATING MENTAL DISORDERS | EISAI CO., LTD (JP) | 2001-08-28 | — | — | US | disclosed |
| EP-0675118-A2 | Biphenylderivatives, process for their preparation and their use as medicaments | Eisai Co., Ltd. (JP) | 1995-10-04 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20200209739-A1 | CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, METHOD OF MANUFACTURING PATTERNED RESIST FILM, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, METHOD OF MANUFACTURING PLATED ARTICLE, AND COMPOUND | CUTA, RAD51, PCNA | CA1 1495/4885CA2 1754/4885CA9 666/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.