SCHEMBL7591871

SCHEMBL7591871

Cc1ccccc1B1OCCCO1

nearest known ligand 0.36

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ACHE P22303 2/20 0.36
TSHR P16473 1/20 0.36
CA1 P00915 3/20 0.33
CA2 P00918 3/20 0.33
CA9 Q16790 2/20 0.33
CA12 O43570 1/20 0.33
MAP3K14 Q99558 1/20 0.31
CYP2A13 Q16696 1/20 0.31
HTT P42858 1/20 0.31
ALDH1A1 P00352 1/20 0.30
CA7 P43166 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6693267 0.91 ACHE (0.39) ACHETSHRCA1CA2CA9
SCHEMBL18124824 0.84 CA1 (0.39) CA1CA2CA9CA12
SCHEMBL13714210 0.76 CA12 (0.32) CA1CA2CA9CA12
SCHEMBL14661091 0.75 TRPA1 (0.37) ACHETSHRCA1CA2CA9
SCHEMBL20312448 0.75 ALOX15 (0.36) TSHRCA1CA2CA9CA12
SCHEMBL7590437 0.75 TSHR (0.36) TSHRCA1CA2CA9CA12
SCHEMBL10018676 0.75 CA1 (0.33) CA1CA2CA9CA12CYP2A13
SCHEMBL17236446 0.75 CA2 (0.37) TSHRCA1CA2CA9CA12
SCHEMBL3790257 0.75 TSHR (0.45) ACHETSHRCA1CA2CA9
SCHEMBL20312458 0.75 ALDH1A1 (0.33) TSHRCA1CA2CA9CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11803122-B2 Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-31 US disclosed
US-11803122-B2 Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-31 US disclosed
US-11754926-B2 Method of forming resist pattern, resist composition and method of producing the same TOKYO OHKA KOGYO CO., LTD. (JP) 2023-09-12 US disclosed
US-11754926-B2 Method of forming resist pattern, resist composition and method of producing the same TOKYO OHKA KOGYO CO., LTD. (JP) 2023-09-12 US disclosed
US-20230273521-A1 CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-31 US disclosed
US-20230229084-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-20 US disclosed
US-20230229084-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-20 US disclosed
US-20230127914-A1 RESIST PATTERN FORMATION METHOD TOKYO OHKA KOGYO CO., LTD. (JP) 2023-04-27 US disclosed
US-20230004085-A1 METHOD FOR MANUFACTURING CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PREMIX SOLUTION FOR PREPARING CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, METHOD FOR MANUFACTURING PHOTOSENSITIVE DRY FILM, AND METHOD FOR MANUFACTURING PATTERNED RESIST FILM TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-05 US disclosed
US-20210356863-A1 CHEMICAL AMPLIFICATION-TYPE PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF PATTERNED RESIST LAYER, PRODUCTION METHOD OF PLATED MOLDED ARTICLE, COMPOUND, AND PRODUCTION METHOD OF COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2021-11-18 US disclosed
US-20140142315-A1 METHOD FOR PRODUCING 1,2-DIHYDROPYRIDINE-2-ONE COMPOUND EISAI R&D MANAGEMENT CO., LTD. (JP) 2014-05-22 US disclosed
WO-2010114243-A2 NOVEL COMPOUNDS FOR ORGANIC ELECTRONIC MATERIAL AND ORGANIC ELECTRONIC DEVICE USING THE SAME DOW ADVANCED DISPLAY MATERIALS,LTD. (KR) 2010-10-07 WO disclosed
EP-0675118-B1 Biphenylderivatives, process for their preparation and their use as medicaments EISAI CO LTD (JP) 2002-10-09 EP disclosed
US-6281214-B1 USEFUL FOR TREATING AND AMELIORATING MENTAL DISORDERS EISAI CO., LTD (JP) 2001-08-28 US disclosed
US-5849912-A Biphenyl derivatives EISAI CO., LTD. (JP) 1998-12-15 US disclosed
EP-0694029-B1 NOVEL METHOD FOR PREPARING BETA-ALKOXY ACRYLIC ACID ROUSSEL UCLAF (FR) 1998-07-29 EP disclosed
US-5744635-A REACTING THE CORRESPONDING HALOGEN SUBSTITUTED COMPOUND WITH AN ORGANOMETALLIC COMPOUND Uclaf, Roussel (FR) 1998-04-28 US disclosed
EP-0694029-A1 NOVEL METHOD FOR PREPARING BETA-ALKOXY ACRYLIC ACID ROUSSEL UCLAF (FR) 1996-01-31 EP disclosed
EP-0675118-A2 Biphenylderivatives, process for their preparation and their use as medicaments Eisai Co., Ltd. (JP) 1995-10-04 EP disclosed
WO-1994024085-A1 NOVEL METHOD FOR PREPARING β-ALKOXY ACRYLIC ACID ROUSSEL UCLAF (FR) 1994-10-27 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20140142315-A1 METHOD FOR PRODUCING 1,2-DIHYDROPYRIDINE-2-ONE COMPOUND DHPS, QDPR, DPYD ACHE 950/4885TSHR 3995/4885CA1 1935/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.