SCHEMBL7707773

SCHEMBL7707773

Nc1c(C(=O)O)cccc1S(=O)(=O)c1cccc(C(=O)O)c1N

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
G6PD P11413 1/20 0.57
CASP7 P55210 1/20 0.57
CASP6 P55212 1/20 0.57
ALOX15 P16050 2/20 0.52
F2 P00734 3/20 0.47
PRSS1 P07477 3/20 0.47
PRSS2 P07478 3/20 0.47
PRSS3 P35030 3/20 0.47
MMP2 P08253 2/20 0.47
CA1 P00915 1/20 0.47
CA2 P00918 1/20 0.47
MMP1 P03956 1/20 0.47
MMP9 P14780 1/20 0.47
MMP8 P22894 1/20 0.47
MMP13 P45452 1/20 0.47
ALDH1A1 P00352 3/20 0.44
TSHR P16473 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
GAA P10253 1/20 0.43
CDC25B P30305 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10589344 0.89 HTR6 (0.55) G6PDCASP7CASP6ALOX15F2
SCHEMBL9618781 0.88 MYC (0.50) G6PDCASP7CASP6ALOX15F2
SCHEMBL3951462 0.86 G6PD (0.60) G6PDCASP7CASP6ALOX15F2
SCHEMBL524233 0.86 CASP7 (0.55) G6PDCASP7CASP6ALOX15F2
SCHEMBL17331336 0.84 MEN1 (0.46) G6PDCASP7CASP6ALOX15MMP2
SCHEMBL6342597 0.84 ALOX15 (0.45) G6PDCASP7CASP6ALOX15MMP2
SCHEMBL5490712 0.82 CASP7 (0.50) G6PDCASP7CASP6ALOX15F2
SCHEMBL6457388 0.82 G6PD (0.55) G6PDCASP7CASP6ALOX15F2
SCHEMBL24478481 0.80 MCL1 (0.50) G6PDCASP7CASP6ALOX15F2
SCHEMBL31494275 0.80 CYP1A2 (0.50) G6PDCASP7CASP6ALOX15F2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6372859-B1 MAKING A PASTE BY MIXING A SOLUTION OF HEAT-RESISTANT RESIN A IN A SOLVENT, FINE PARTICLES OF RESIN B INSOLUBLE IN THE SOLVENT BUT SOLUBLE UPON HEATING; HEATING TO DISSOLVE; COOLING TO DEPOSIT OR DISPERSE THE PARTICLES; CURING HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-04-16 US disclosed
EP-0984051-A1 HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-03-08 EP disclosed