SCHEMBL7713661

SCHEMBL7713661

Nc1cccc(S(=O)(=O)c2cccc(N)c2C(=O)O)c1C(=O)O

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ GAA P10253 1/20 0.54
▸ CDC25B P30305 1/20 0.47
▸ HTR6 P50406 1/20 0.47
▸ TTR P02766 1/20 0.44
▸ MMP2 P08253 2/20 0.42
▸ CA1 P00915 5/20 0.42
▸ CA2 P00918 5/20 0.42
▸ CA12 O43570 4/20 0.42
▸ CA9 Q16790 4/20 0.42
▸ CA7 P43166 3/20 0.42
▸ CA14 Q9ULX7 3/20 0.42
▸ CA4 P22748 2/20 0.42
▸ CYP2C9 P11712 1/20 0.42
▸ CA6 P23280 1/20 0.42
▸ CA5A P35218 1/20 0.42
▸ CA5B Q9Y2D0 1/20 0.42
▸ KYNU Q16719 2/20 0.41
▸ METAP2 P50579 1/20 0.40
▸ ALDH1A1 P00352 1/20 0.37
▸ F2 P00734 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11872448 0.86 CA1 (0.55) GAAHTR6TTRMMP2CA1
SCHEMBL11572594 0.86 TTR (0.56) GAACDC25BHTR6TTRMMP2
SCHEMBL28934029 0.82 CDC25B (0.53) GAACDC25BHTR6CA1CA2
SCHEMBL1000014 0.80 MMP2 (0.54) GAACDC25BMMP2CA1CA2
SCHEMBL6741095 0.80 GAA (0.46) GAACDC25BHTR6TTRMMP2
SCHEMBL29435078 0.78 ALOX15 (0.48) CDC25BMMP2CA1CA2CA12
SCHEMBL347237 0.78 ALOX15 (0.48) CDC25BMMP2CA1CA2CA12
SCHEMBL18043789 0.76 MMP2 (0.50) GAACDC25BMMP2CA1CA2
SCHEMBL4586320 0.73 GAA (0.67) GAACDC25BHTR6MMP2CA1
SCHEMBL564728 0.72 GAA (0.60) GAACDC25BHTR6TTRMMP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6372859-B1 MAKING A PASTE BY MIXING A SOLUTION OF HEAT-RESISTANT RESIN A IN A SOLVENT, FINE PARTICLES OF RESIN B INSOLUBLE IN THE SOLVENT BUT SOLUBLE UPON HEATING; HEATING TO DISSOLVE; COOLING TO DEPOSIT OR DISPERSE THE PARTICLES; CURING HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-04-16 — — US disclosed
EP-0984051-A1 HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-03-08 — — EP disclosed
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