Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 2/20 | 0.50 |
| ▸ | CA1 | P00915 | 2/20 | 0.50 |
| ▸ | CA2 | P00918 | 2/20 | 0.50 |
| ▸ | CA7 | P43166 | 2/20 | 0.50 |
| ▸ | CA9 | Q16790 | 2/20 | 0.50 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.50 |
| ▸ | MMP2 | P08253 | 1/20 | 0.44 |
| ▸ | HTT | P42858 | 1/20 | 0.39 |
| ▸ | CTNNB1 | P35222 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28415540 | 0.87 | NCOA1 (0.49) | CA12CA1CA2CA7CA9 | |
| SCHEMBL6741095 | 0.85 | GAA (0.46) | CA12CA1CA2CA7CA9 | |
| SCHEMBL284305 | 0.84 | CA12 (0.74) | CA12CA1CA2CA7CA9 | |
| SCHEMBL6734541 | 0.83 | ALDH1A1 (0.41) | CA12CA1CA2CA7CA9 | |
| SCHEMBL1000014 | 0.82 | MMP2 (0.54) | CA12CA1CA2CA7CA9 | |
| SCHEMBL6469761 | 0.80 | ALDH1A1 (0.56) | CA12CA1CA2CA7CA9 | |
| SCHEMBL15971390 | 0.80 | CA12 (0.43) | CA12CA1CA2CA7CA9 | |
| SCHEMBL7781072 | 0.80 | CA12 (0.43) | CA12CA1CA2CA7CA9 | |
| SCHEMBL18043789 | 0.78 | MMP2 (0.50) | CA12CA1CA2CA7CA9 | |
| SCHEMBL9873829 | 0.77 | CYP1A2 (0.48) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6372859-B1 | MAKING A PASTE BY MIXING A SOLUTION OF HEAT-RESISTANT RESIN A IN A SOLVENT, FINE PARTICLES OF RESIN B INSOLUBLE IN THE SOLVENT BUT SOLUBLE UPON HEATING; HEATING TO DISSOLVE; COOLING TO DEPOSIT OR DISPERSE THE PARTICLES; CURING | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-04-16 | — | — | US | disclosed |
| EP-0984051-A1 | HEAT-RESISTANT ADHESIVES AND SEMICONDUCTOR DEVICES PRODUCED THEREWITH | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-03-08 | — | — | EP | disclosed |