SCHEMBL782136

SCHEMBL782136

C[N+](C)(C)C(O)c1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 4/20 0.46
KDM4E B2RXH2 3/20 0.44
ADRA2C P18825 2/20 0.44
ADRA2A P08913 1/20 0.44
HIF1A Q16665 1/20 0.44
ALDH1A1 P00352 2/20 0.43
MAPK1 P28482 1/20 0.42
TSHR P16473 2/20 0.41
CHRM2 P08172 1/20 0.41
ADRA1A P35348 1/20 0.41
RGS12 O14924 1/20 0.41
GLA P06280 1/20 0.41
CYP3A4 P08684 1/20 0.41
CYP2D6 P10635 1/20 0.41
CYP2C9 P11712 1/20 0.41
PKM P14618 1/20 0.41
ALOX15 P16050 1/20 0.41
ALOX12 P18054 1/20 0.41
NFKB1 P19838 1/20 0.41
HTR2A P28223 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Bromide SCHEMBL27950505 0.97 LMNA (0.44) LMNAKDM4EADRA2CADRA2AHIF1A
Hydrochloric Acid SCHEMBL27724453 0.97 LMNA (0.44) LMNAKDM4EADRA2CADRA2AHIF1A
SCHEMBL27730667 0.74 TRPA1 (0.41) LMNATSHRHTR2ATRPA1
SCHEMBL3386727 0.73 ADRA2C (0.57) LMNAKDM4EADRA2CADRA2AHIF1A
SCHEMBL7892362 0.73 ADRA2C (0.57) LMNAKDM4EADRA2CADRA2AHIF1A
SCHEMBL1618600 0.72 CYP1A2 (0.52) LMNAADRA2CADRA2ATSHRHTR2A
Bromide SCHEMBL27999020 0.72 CES2 (0.39) LMNATSHRCHRM2HTR2ATRPA1
Hydrochloric Acid SCHEMBL3386662 0.72 ADRA2C (0.55) LMNAKDM4EADRA2CADRA2AHIF1A
Bromide SCHEMBL306447 0.72 ADRA2C (0.55) LMNAKDM4EADRA2CADRA2AHIF1A
Water SCHEMBL10366292 0.72 ADRA2C (0.55) LMNAKDM4EADRA2CADRA2AHIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-1203369-A None JP disclosed
EP-1654331-B1 PAINT COMPRISING A LIQUID PHASE AND AN ACTIVE POWDER PHASE AKZO NOBEL COATINGS INT BV (NL) 2013-12-11 EP disclosed
US-20120070571-A1 PAINT COMPRISING A LIQUID PHASE AND AN ACTIVE POWDER PHASE AKZO NOBEL COATINGS INTERNATIONAL B.V. (NL) 2012-03-22 US disclosed
US-8048482-B2 Paint comprising a liquid phase and an active powder phase AKZO NOBEL COATINGS INTERNATIONAL B.V. (NL) 2011-11-01 US disclosed
US-20080281014-A1 Nanosubstance-Containing Composition, Process for Producing the Same, and Composite Made With the Same MITSUBISHI RAYON CO., LTD. (JP) 2008-11-13 US disclosed
US-20060222765-A1 Paint comprising a liquid phase and an active powder phase AKZO NOBEL COATING INTERNATIONAL B.V. (NL) 2006-10-05 US disclosed
US-7087664-B2 Resin film and multilayer printed wiring board using thereof SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2006-08-08 US disclosed
EP-1654331-A1 PAINT COMPRISING A LIQUID PHASE AND AN ACTIVE POWDER PHASE Akzo Nobel Coatings International B.V. (NL) 2006-05-10 EP disclosed
WO-2005017054-A1 PAINT COMPRISING A LIQUID PHASE AND AN ACTIVE POWDER PHASE AKZO NOBEL COATINGS INTERNATIONAL B.V. (NL) 2005-02-24 WO disclosed
US-20040214005-A1 Resin film and multilayer printed wiring board using thereof SUMITOMO CHEMICAL COMPANY, LIMITED 2004-10-28 US disclosed
US-20030114574-A1 Process for producing thermosetting resin varnish SUMITOMO CHEMICAL COMPANY, LIMITED 2003-06-19 US disclosed
US-20030044588-A1 Insulating resin composition for multi-layered printed circuit wiring board, multi-layerd printed circuit wiring board using the particular resin composition, and manufacturing the same TOPPAN PRINTING CO., LTD. (JP) 2003-03-06 US disclosed
CN-1386131-A Insulating resin composition for multilayer printed wiring boards, multilayer printed wiring boards made by using the composition and process for the production thereof TOPPAN PRINTING CO LTD (JP) 2002-12-18 CN disclosed
EP-1254926-A1 INSULATING RESIN COMPOSITION FOR MULTILAYER PRINTED WIRING BOARDS, MULTILAYER PRINTED WIRING BOARDS MADE BY USING THE COMPOSITION AND PROCESS FOR THE PRODUCTION THEREOF Toppan Printing Co., Ltd. (JP) 2002-11-06 EP disclosed
US-6255409-B1 EPOXY RESIN COMPOSITION COMPRISING BIFUNCTIONAL CRYSTALLINE EPOXY COMPOUND, AMORPHOUS TRISPHENOLMETHANE TYPE EPOXY COMPOUND HAVING THREE OR MORE EPOXY GROUPS IN MOLECULE, AND EPOXY CURING AGENT HAVING PHENOLIC HYDROXYL GROUPS SUMITOMO CHEMICAL CO., LTD. (JP) 2001-07-03 US disclosed
EP-0943639-A2 Epoxy resin composition and resin-encapsulated semiconductor device SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1999-09-22 EP disclosed
CN-1021403-C AGRICULTURAL COMPOSITION CONTAINING PROPENOIC ACID DERIVANT ICI PLC (GB) 1993-06-30 CN disclosed
JP-H01203369-A PREPARATION OF 3-(4-BROMO-2-FLUOROPHENYL)METHYL-)-3,4-DIHYDRO-4-OXO-1-PHTHALAZINE-ACETIC ACID MERCK & CO INC 1989-08-16 JP disclosed