SCHEMBL7945362

SCHEMBL7945362

O=C(O)c1cc(Cc2ccc(O)cc2)cc(C(=O)O)c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.56
ESR2 Q92731 1/20 0.56
CA2 P00918 3/20 0.52
CA12 O43570 2/20 0.52
CA1 P00915 2/20 0.52
CA7 P43166 2/20 0.52
CA9 Q16790 2/20 0.52
CA14 Q9ULX7 2/20 0.52
CA3 P07451 1/20 0.52
TYR P14679 1/20 0.52
DRD1 P21728 1/20 0.52
CA4 P22748 1/20 0.52
CA6 P23280 1/20 0.52
CA5A P35218 1/20 0.52
CA5B Q9Y2D0 1/20 0.52
SRD5A2 P31213 3/20 0.47
CAMK2A Q9UQM7 1/20 0.47
KLKB1 P03952 1/20 0.46
CTSB P07858 1/20 0.46
MMP9 P14780 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28951143 0.88 SRD5A2 (0.58) CA2CA12CA1CA7CA9
SCHEMBL2130368 0.85 CA2 (0.73) ESR1ESR2CA2CA12CA1
SCHEMBL1950244 0.85 CA12 (0.48) CA2CA12CA1CA7CA9
SCHEMBL2142442 0.83 PLA2G10 (0.53) CA2CA1CA9SRD5A2HNF4A
SCHEMBL4701641 0.83 CA1 (0.60) ESR1ESR2CA2CA12CA1
SCHEMBL11673315 0.83 SRD5A2 (0.62) CA2CA12CA1CA7CA9
SCHEMBL28029673 0.82 PPARA (0.49) CA2CA1CA9SRD5A2KMT2A
SCHEMBL28129556 0.82 ALOX15 (0.54) SRD5A2
SCHEMBL27846001 0.81 ALDH1A1 (0.59) CA2CA12CA1CA9CA14
SCHEMBL29128758 0.81 DHODH (0.56) CA2CA12CA1CA9CA14

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-100457823-C Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof MITSUI CHEMICALS INC (JP) 2009-02-04 CN disclosed
CN-1285636-C Process for producing oxyalkylene derivative MITSUI CHEMICALS INC (JP) 2006-11-22 CN disclosed
CN-1781985-A Epoxy resin composition, cured article obtained from the epoxy resin, and semiconductor device obtained thereof MITSUI CHEMICALS INC (JP) 2006-06-07 CN disclosed
CN-1200915-C Process for preparing organic compound MITSUI CHEMICALS INC (JP) 2005-05-11 CN disclosed
CN-1592764-A Method for producing organic compound, epoxy resin composition, cured product of the epoxy resin, and semiconductor device formed using the epoxy resin MITSUI CHEMICALS INC (JP) 2005-03-09 CN disclosed
CN-1190441-C Phosphine sulfide preparing process and use thereof MITSUI CHEMICALS INC (JP) 2005-02-23 CN disclosed
US-6255444-B1 COMPOSITION CONTAINING DENDRIMER AND POLYMERIZATION INITIATOR AS ESSENTIAL COMPONENTS; LOW VISCOSITY, HIGHLY CURABLE, FORMS COATING FILM WITH EXCELLENT HEAT AND MOISTURE RESISTANCE NIPPON STEEL CHEMICAL CO., LTD. (JP) 2001-07-03 US disclosed
EP-1006101-A1 AROMATIC ESTER (METH)ACRYLATE DENDRIMER AND CURABLE RESIN COMPOSITION Nippon Steel Chemical Co., Ltd. (JP) 2000-06-07 EP disclosed
CN-1235141-A Process for preparing organic compound MITSUI CHEMICALS INC (JP) 1999-11-17 CN disclosed