SCHEMBL7980544

SCHEMBL7980544

C[Si](C)(C)O[Si](C)(OCN1C(=O)C=CC1=O)OCN1C(=O)C=CC1=O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 10/20 0.41
ALDH1A1 P00352 3/20 0.41
BLM P54132 2/20 0.41
LMNA P02545 2/20 0.41
MAPT P10636 2/20 0.41
NPSR1 Q6W5P4 2/20 0.41
GMNN O75496 1/20 0.41
THPO P40225 1/20 0.41
PMP22 Q01453 1/20 0.41
HPGD P15428 2/20 0.40
CYP1A2 P05177 1/20 0.40
CYP2C19 P33261 1/20 0.40
WRN Q14191 1/20 0.40
HIF1A Q16665 1/20 0.40
FAAH O00519 4/20 0.37
HSP90AA1 P07900 2/20 0.35
TLR9 Q9NR96 1/20 0.35
TP53 P04637 1/20 0.35
PKM P14618 1/20 0.35
XBP1 P17861 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7982646 0.89 MGLL (0.36) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL24854625 0.79 MGLL (0.44) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL6480093 0.79 MGLL (0.48) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL7522123 0.69 MGLL (0.57) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL8734601 0.68 MGLL (0.52) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL277926 0.66 MGLL (0.55) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL9576348 0.66 MGLL (0.36) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL2454775 0.65 MGLL (0.38) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL145760 0.65 MGLL (0.56) MGLLALDH1A1BLMLMNAMAPT
SCHEMBL690365 0.64 MGLL (0.42) MGLLALDH1A1BLMLMNAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6271335-B1 HEATING A MIXTURE OF AT LEAST ONE BIS(MALEIMIDE) COMPOUND AND AT LEAST ONE MONOMERIC TRIS(FURAN) OR TETRAKIS(FURAN) COMPOUND TO FORM A GEL AND COOLING; HEATING TO A TEMPERATURE GREATER THAN 90 DEGREE C. WILL DEPOLYMERIZE THE GEL SANDIA CORPORATION 2001-08-07 US disclosed