Sugi Predict

Sugi Predict / Compounds / SCHEMBL801356

SCHEMBL801356

SCHEMBL801356

CCC(C)(C)C(=O)OCCNC(=O)Nc1ccccc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ SMN1; SMN2 Q16637 1/20 0.53
▸ NPSR1 Q6W5P4 3/20 0.53
▸ GAA P10253 2/20 0.53
▸ EPHX1 P07099 4/20 0.52
▸ ALDH1A1 P00352 3/20 0.52
▸ HTT P42858 2/20 0.52
▸ LMNA P02545 2/20 0.49
▸ MAPT P10636 1/20 0.49
▸ CYP1A2 P05177 1/20 0.47
▸ CYP3A4 P08684 1/20 0.47
▸ CYP2D6 P10635 1/20 0.47
▸ CYP2C9 P11712 1/20 0.47
▸ TSHR P16473 1/20 0.47
▸ CYP2C19 P33261 1/20 0.47
▸ HSD17B10 Q99714 1/20 0.47
▸ FPR2 P25090 1/20 0.47
▸ KDM4E B2RXH2 1/20 0.47
▸ EPHX2 P34913 3/20 0.46
▸ ATM Q13315 1/20 0.45
▸ L3MBTL1 Q9Y468 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13667487 0.92 ALDH1A1 (0.57) SMN1; SMN2NPSR1GAAEPHX1ALDH1A1
SCHEMBL801355 0.88 EPHX2 (0.48) SMN1; SMN2NPSR1GAAEPHX1ALDH1A1
SCHEMBL1104199 0.88 MAPT (0.46) SMN1; SMN2NPSR1GAAALDH1A1MAPT
SCHEMBL14983567 0.87 SMN1; SMN2 (0.57) SMN1; SMN2NPSR1GAAEPHX1ALDH1A1
SCHEMBL2742140 0.86 EPHX2 (0.49) NPSR1GAAEPHX1ALDH1A1MAPT
SCHEMBL13223590 0.85 EPHX1 (0.47) SMN1; SMN2NPSR1GAAEPHX1ALDH1A1
SCHEMBL24885716 0.84 SMN1; SMN2 (0.53) SMN1; SMN2NPSR1GAAEPHX1ALDH1A1
SCHEMBL13667491 0.83 ITGB3 (0.54) SMN1; SMN2GAAALDH1A1MAPTKDM4E
SCHEMBL13667501 0.83 CA2 (0.60) KDM4EL3MBTL1
SCHEMBL13125290 0.82 MAPT (0.51) SMN1; SMN2NPSR1GAAALDH1A1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10025011-B2 Composition, infrared transmission filter and method for manufacturing the same, and infrared sensor FUJIFILM CORPORATION (JP) 2018-07-17 — — US disclosed
US-9810821-B2 Infrared ray cutoff filter FUJIFILM CORPORATION (JP) 2017-11-07 — — US disclosed
US-9664827-B2 Colored composition, method of producing color filter using the same, color filter and solid-state imaging device FUJIFILM CORPORATION (JP) 2017-05-30 — — US disclosed
US-9632222-B2 Method for manufacturing a color filter, color filter and solid-state imaging device FUJIFILM CORPORATION (JP) 2017-04-25 — — US disclosed
US-9625618-B2 Optical member set and solid-state imaging element using the same FUJIFILM CORPORATION (JP) 2017-04-18 — — US disclosed
US-9507257-B2 Method for manufacturing a color filter, color filter and solid-state imaging device FUJIFILM CORPORATION (JP) 2016-11-29 — — US disclosed
US-9442374-B2 Coloring composition, method for manufacturing a color filter using the same, color filter and solid-state imaging device FUJIFILM CORPORATION (JP) 2016-09-13 — — US disclosed
US-9389507-B2 Polymerizable composition, and photosensitive layer, permanent pattern, wafer-level lens, solid-state imaging device and pattern forming method each using the composition FUJIFILM CORPORATION (JP) 2016-07-12 — — US disclosed
US-9389505-B2 Polymerizable composition for solder resist, and solder resist pattern formation method FUJIFILM CORPORATION (JP) 2016-07-12 — — US disclosed
US-9354514-B2 Photosensitive transparent composition for color filter of solid-state imaging device, and production method of color filter of solid-state imaging device, color filter of solid-state imaging device, and solid-state imaging device, each using the same FUJIFILM CORPORATION (JP) 2016-05-31 — — US disclosed
US-20130072615-A1 POLYMERIZABLE COMPOSITION FUJIFILM CORPORATION (JP) 2013-03-21 — — US disclosed
US-20130034812-A1 POLYMERIZABLE COMPOSITION FOR SOLDER RESIST, AND SOLDER RESIST PATTERN FORMATION METHOD FUJIFILM CORPORATION (JP) 2013-02-07 — — US disclosed
US-20120257283-A1 DISPERSION COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, AND SOLID-STATE IMAGE PICK-UP ELEMENT FUJIFILM CORPORATION (JP) 2012-10-11 — — US disclosed
US-8278386-B2 Dispersion composition, polymerizable composition, light-shielding color filter, solid-state image pick-up element, liquid crystal display device, wafer level lens, and image pick-up unit FUJIFILM CORPORATION (JP) 2012-10-02 — — US disclosed
US-20120235099-A1 RADIATION-SENSITIVE COLORED COMPOSITION, COLORED CURED FILM, COLOR FILTER AND METHOD OF PRODUCING THE SAME, SOLID-STATE IMAGING DEVICE, LIQUID CRYSTAL DISPLAY APPARATUS, AND METHOD OF PRODUCING DYE FUJIFILM CORPORATION (JP) 2012-09-20 — — US disclosed
US-20120199727-A1 TITANIUM BLACK DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, WAFER LEVEL LENS, LIGHT BLOCKING FILM, METHOD FOR PRODUCING THE LIGHT BLOCKING FILM, AND SOLID-STATE IMAGE PICKUP ELEMENT FUJIFILM CORPORATION (JP) 2012-08-09 — — US disclosed
US-20120104529-A1 COLORED COMPOSITION FOR LIGHT-SHIELDING FILM, LIGHT-SHIELDING PATTERN, METHOD FOR FORMING THE SAME, SOLID-STATE IMAGE SENSING DEVICE, AND METHOD FOR PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2012-05-03 — — US disclosed
US-20120068292-A1 POLYMERIZABLE COMPOSITION, AND PHOTOSENSITIVE LAYER, PERMANENT PATTERN, WAFER-LEVEL LENS, SOLID-STATE IMAGING DEVICE AND PATTERN FORMING METHOD EACH USING THE COMPOSITION FUJIFILM CORPORATION (JP) 2012-03-22 — — US disclosed
US-20110124824-A1 DISPERSION COMPOSITION, POLYMERIZABLE COMPOSITION, LIGHT-SHIELDING COLOR FILTER, SOLID-STATE IMAGE PICK-UP ELEMENT, LIQUID CRYSTAL DISPLAY DEVICE, WAFER LEVEL LENS, AND IMAGE PICK-UP UNIT FUJIFILM CORPORATION (JP) 2011-05-26 — — US disclosed
US-20090246693-A1 NEGATIVE-WORKING LITHOGRAPHIC PRINTING PLATE PRECURSOR AND METHOD OF LITHOGRAPHIC PRINTING USING SAME FUJIFILM CORPORATION (JP) 2009-10-01 — — US disclosed