Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.49 |
| ▸ | TSHR | P16473 | 6/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.46 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.46 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.45 |
| ▸ | TP53 | P04637 | 1/20 | 0.45 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.45 |
| ▸ | LMNA | P02545 | 1/20 | 0.44 |
| ▸ | HTT | P42858 | 1/20 | 0.43 |
| ▸ | SLC22A1 | O15245 | 1/20 | 0.43 |
| ▸ | SCN1A | P35498 | 3/20 | 0.43 |
| ▸ | SCN2A | Q99250 | 3/20 | 0.43 |
| ▸ | SCN3A | Q9NY46 | 3/20 | 0.43 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.42 |
| ▸ | GABRB1 | P18505 | 1/20 | 0.42 |
| ▸ | GABRA3 | P34903 | 1/20 | 0.42 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.42 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.42 |
| ▸ | PKM | P14618 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4650332 | 0.95 | ALDH1A1 (0.44) | ALDH1A1TSHRTDP1L3MBTL1MAPK1 | |
| SCHEMBL407047 | 0.85 | TSHR (0.50) | ALDH1A1TSHRTDP1L3MBTL1MAPK1 | |
| SCHEMBL27907804 | 0.85 | ALDH1A1 (0.69) | ALDH1A1TSHRTDP1L3MBTL1MAPK1 | |
| SCHEMBL204946 | 0.83 | TSHR (0.67) | ALDH1A1TSHRTDP1L3MBTL1MAPK1 | |
| SCHEMBL29754649 | 0.83 | TSHR (0.67) | ALDH1A1TSHRTDP1L3MBTL1MAPK1 | |
| 2-Mercaptobenzimidazole SCHEMBL28943150 | 0.83 | MAPT (0.41) | ALDH1A1TSHRL3MBTL1LMNAHTT | |
| SCHEMBL3454897 | 0.82 | TSHR (0.67) | ALDH1A1TSHRTDP1L3MBTL1MAPK1 | |
| SCHEMBL27477230 | 0.81 | TSHR (0.71) | ALDH1A1TSHRTDP1L3MBTL1MAPK1 | |
| SCHEMBL29155869 | 0.81 | SCN1A (0.64) | ALDH1A1TSHRCYP3A4LMNASCN1A | |
| SCHEMBL27189850 | 0.80 | TSHR (0.70) | ALDH1A1TSHRTDP1L3MBTL1MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 393 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1780747-A2 | A conductive electrode powder, a method for preparing the same, and uses thereof | Samsung SDI Co., Ltd. (KR) | 2007-05-02 | — | — | EP | claimed |
| US-20070092987-A1 | Conductive electrode powder, a method for preparing the same, a method for preparing an electrode of a plasma display panel by using the same, and a plasma display panel comprising the same | SAMSUNG SDI CO., LTD. (KR) | 2007-04-26 | — | — | US | claimed |
| US-20050179355-A1 | Composition for forming an electron emission source for use in an electron emission device and an electron emission source prepared therefrom | SAMSUNG SDI CO., LTD. (KR) | 2005-08-18 | — | — | US | claimed |
| WO-2026100508-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-20260063999-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-03-05 | — | — | US | disclosed |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-02-05 | — | — | US | disclosed |
| US-20260003274-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2026-01-01 | — | — | US | disclosed |
| US-20260003276-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2026-01-01 | — | — | US | disclosed |
| EP-0935275-A1 | PLASMA DISPLAY AND METHOD FOR MANUFACTURING THE SAME | TORAY INDUSTRIES, INC. (JP) | 1999-08-11 | — | — | EP | disclosed |
| CN-1216149-A | Method and device for mfg. plasma display | TORAY INDUSTRIES (JP) | 1999-05-05 | — | — | CN | disclosed |
| EP-0884754-A1 | METHOD AND DEVICE FOR MANUFACTURING PLASMA DISPLAY | TORAY INDUSTRIES, INC. (JP) | 1998-12-16 | — | — | EP | disclosed |
| EP-0845445-A1 | PHOTOSENSITIVE CERAMIC GREEN SHEET, CERAMIC PACKAGE, AND PROCESS FOR PRODUCING THE SAME | TORAY INDUSTRIES, INC. (JP) | 1998-06-03 | — | — | EP | disclosed |
| US-5532105-A | HAVING GOOD ADHESION TO PLATED COPPER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1996-07-02 | — | — | US | disclosed |
| US-5397682-A | Polyimide precursor and photosensitive composition containing the same | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1995-03-14 | — | — | US | disclosed |
| EP-0602252-A1 | CERAMIC GREEN SHEET | TORAY INDUSTRIES, INC. (JP) | 1994-06-22 | — | — | EP | disclosed |
| WO-1994006057-A1 | POLYIMIDE PRECURSOR AND PHOTOSENSITIVE COMPOSITION CONTAINING THE SAME | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1994-03-17 | — | — | WO | disclosed |
| US-5262277-A | Light sensitive elements for electrical thick films with heat resistance | HITACHI CHEMICAL COMPANY, INC. (JP) | 1993-11-16 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (6 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | ALDH1A1 3316/4885TSHR 3312/4885TDP1 2890/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | ALDH1A1 413/4885TSHR 2388/4885TDP1 2942/4885 |
| US-20260003274-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | SEM1, ASIC1, SMARCB1 | ALDH1A1 1444/4885TSHR 3322/4885TDP1 3155/4885 |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | RER1, ASIC1, FRG1 | ALDH1A1 2344/4885TSHR 1401/4885TDP1 1747/4885 |
| US-20260003276-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | RER1, SEM1, RAD51 | ALDH1A1 460/4885TSHR 2884/4885TDP1 1875/4885 |
| US-20260063999-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM | ARCN1, PBRM1, LCP1 | ALDH1A1 1600/4885TSHR 4458/4885TDP1 1196/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.