Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PTPN1 | P18031 | 4/20 | 0.39 |
| ▸ | CDC25B | P30305 | 6/20 | 0.37 |
| ▸ | MEN1 | O00255 | 3/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.37 |
| ▸ | MAPT | P10636 | 4/20 | 0.35 |
| ▸ | LMNA | P02545 | 3/20 | 0.35 |
| ▸ | BLM | P54132 | 3/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.35 |
| ▸ | RAB9A | P51151 | 3/20 | 0.35 |
| ▸ | PLIN1 | O60240 | 2/20 | 0.35 |
| ▸ | MAOA | P21397 | 2/20 | 0.35 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.35 |
| ▸ | PLIN5 | Q00G26 | 2/20 | 0.35 |
| ▸ | ABHD5 | Q8WTS1 | 2/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.35 |
| ▸ | POLB | P06746 | 2/20 | 0.35 |
| ▸ | S100A4 | P26447 | 2/20 | 0.35 |
| ▸ | APAF1 | O14727 | 2/20 | 0.35 |
| ▸ | TDP2 | O95551 | 2/20 | 0.35 |
| ▸ | NPC1 | O15118 | 2/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15334634 | 0.85 | PTGS2 (0.33) | PTPN1PTGS2 | |
| SCHEMBL13324452 | 0.83 | PTPN1 (0.37) | PTPN1CDC25BMEN1KMT2AMAPT | |
| SCHEMBL1705474 | 0.83 | PTPN1 (0.39) | PTPN1CDC25BMEN1KMT2AMAPT | |
| SCHEMBL9774897 | 0.83 | PTPN1 (0.39) | PTPN1CDC25BMEN1KMT2AMAPT | |
| SCHEMBL3399109 | 0.83 | PTPN1 (0.39) | PTPN1CDC25BMEN1KMT2AMAPT | |
| SCHEMBL30773549 | 0.83 | PTPN1 (0.39) | PTPN1CDC25BMEN1KMT2AMAPT | |
| SCHEMBL3398101 | 0.83 | PTPN1 (0.39) | PTPN1CDC25BMEN1KMT2AMAPT | |
| SCHEMBL12268106 | 0.82 | MAPT (0.39) | PTPN1CDC25BMEN1KMT2AMAPT | |
| SCHEMBL15624668 | 0.82 | PTPN1 (0.36) | PTPN1CDC25BMEN1KMT2AMAPT | |
| Hydrochloric Acid SCHEMBL8031975 | 0.81 | PTPN1 (0.38) | PTPN1CDC25BMEN1KMT2AMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 153 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| US-20240018306-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR SYNTHESIZING POLYIMIDE PRECURSOR | RESONAC CORPORATION (JP) | 2024-01-18 | — | — | US | disclosed |
| US-11822242-B2 | DNQ-type photoresist composition including alkali-soluble acrylic resins | MERCK PATENT GMBH (DE) | 2023-11-21 | — | — | US | disclosed |
| US-20230369271-A1 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | TORAY INDUSTRIES, INC. (JP) | 2023-11-16 | — | — | US | disclosed |
| US-11802181-B2 | Di-amine compound, and heat-resistant resin and resin composition using the same | TORAY INDUSTRIES, INC. (JP) | 2023-10-31 | — | — | US | disclosed |
| US-11768434-B2 | Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-09-26 | — | — | US | disclosed |
| US-20230221639-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-07-13 | — | — | US | disclosed |
| US-11640112-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2023-05-02 | — | — | US | disclosed |
| US-20180224741-A1 | COMPOSITIONS AND METHODS FOR FORMING A PIXEL-DEFINING LAYER | ROHM & HAAS ELECT MAT (US) | 2018-08-09 | — | — | US | disclosed |
| US-20180203353-A1 | CURED FILM AND METHOD FOR MANUFACTURING SAME | TORAY INDUSTRIES, INC. (JP) | 2018-07-19 | — | — | US | disclosed |
| US-20080020317-A1 | Novel metal nanoparticle and formation of conductive pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2008-01-24 | — | — | US | disclosed |
| US-7256419-B2 | Composition for forming organic insulating film and organic insulating film formed from the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-08-14 | — | — | US | disclosed |
| US-20070154843-A1 | Resin and resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2007-07-05 | — | — | US | disclosed |
| US-7238455-B2 | Mixture of alkali soluble resin, quinonediazide compound and alcohol | SUMITOMO BAKELITE COMPANY, LTD. (JP) | 2007-07-03 | — | — | US | disclosed |
| US-7229747-B2 | Surface treatment of interpenetrating polymer networkcarbon tubes; photolithography; heat curing; negative patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-06-12 | — | — | US | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| US-7220520-B2 | Photosensitive resin compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2007-05-22 | — | — | US | disclosed |
| US-7214455-B2 | Photosensitive resin composition and process for producing heat-resistant resin film | TORAY INDUSTRIES, INC. (JP) | 2007-05-08 | — | — | US | disclosed |
| US-20070099111-A1 | Novel positive photosensitive polybenzoxazole precursor compositions | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. | 2007-05-03 | — | — | US | disclosed |
| US-7195849-B2 | Photosensitive resin compositions | ARCH SPECIALTY CHEMICALS, INC. (US) | 2007-03-27 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-11802181-B2 | Di-amine compound, and heat-resistant resin and resin composition using the same | CAD, ARID2, SMC3 | PTPN1 4574/4885CDC25B 3722/4885MEN1 4033/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.