SCHEMBL8202664

SCHEMBL8202664

CC1CCC(C(C)C)C(c2ccc(Oc3ccc(N)cc3)cc2)C1

nearest known ligand 0.39

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.39
TDP1 Q9NUW8 2/20 0.39
CYP3A4 P08684 1/20 0.39
TSHR P16473 1/20 0.39
KDM1A O60341 1/20 0.39
TRPV1 Q8NER1 3/20 0.38
TRPM8 Q7Z2W7 2/20 0.38
OPRM1 P35372 1/20 0.38
HPGD P15428 1/20 0.38
LMNA P02545 1/20 0.38
TEAD4 Q15561 1/20 0.38
POLB P06746 1/20 0.37
MAPT P10636 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.36
TRPA1 O75762 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8694523 0.85 OPRM1 (0.37) ALDH1A1TDP1TRPV1TRPM8OPRM1
SCHEMBL15938103 0.83 OPRM1 (0.37) ALDH1A1TDP1CYP3A4TSHRTRPV1
SCHEMBL27199253 0.82 TRPM8 (0.53) KDM1ATRPV1TRPM8
SCHEMBL8202662 0.81 KDM1A (0.45) ALDH1A1KDM1ATRPV1TRPM8OPRM1
SCHEMBL29549463 0.79 TRPM8 (0.46) ALDH1A1TRPV1TRPM8OPRM1HPGD
SCHEMBL8540276 0.78 ALDH1A1 (0.35) ALDH1A1TRPV1TRPM8OPRM1HPGD
SCHEMBL9737051 0.77 TRPA1 (0.43) ALDH1A1CYP3A4TRPV1TRPM8OPRM1
SCHEMBL8498806 0.77 TRPA1 (0.43) ALDH1A1CYP3A4TRPV1TRPM8OPRM1
SCHEMBL6378310 0.76 TRPM8 (0.42) ALDH1A1TRPV1TRPM8OPRM1HPGD
SCHEMBL5194290 0.76 TRPM8 (0.42) ALDH1A1TRPV1TRPM8OPRM1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6037438-A AS LAMINATES IN THE ELECTRIC AND ELECTRONIC FIELDS IN WHICH LOW-DIELECTRIC PROPERTY IS DESIRED AND ALSO APPLICABLE TO USES OF SEALING AND MOLDING SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2000-03-14 US disclosed
EP-0612783-B1 Cyanate resin composition and copper-clad laminate SUMITOMO CHEMICAL CO (JP) 1999-05-06 EP disclosed
US-5750789-A FROM CORRESPONDING DIAMINE SUMITOMO CHEMICAL COMPANY LIMITED (JP) 1998-05-12 US disclosed
EP-0612782-B1 Cyanate resin composition and copper-clad laminate using the composition SUMITOMO CHEMICAL CO (JP) 1997-05-02 EP disclosed
US-5563237-A INCLUDES A BISMALEIMIDE HARDENER SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1996-10-08 US disclosed
US-5498687-A Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1996-03-12 US disclosed
US-5444165-A Reacting diamino compound with unsaturated dicarboxylic anhydride to form amic acid intermediate, catalytic dehydration-ring closing; solvent soluble, low water absorption and flexibility SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1995-08-22 US disclosed
EP-0612782-A1 Cyanate resin composition and copper-clad laminate using the composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-08-31 EP disclosed
EP-0612783-A1 Cyanate resin composition and copper-clad laminate SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-08-31 EP disclosed
US-5326881-A Polymers with good heat resistance, good flexibility and low water absorption SUMITOMO CHEMICAL COMPANY LTD. (JP) 1994-07-05 US disclosed
EP-0595230-A1 Unsaturated imide compounds containing alicyclic structure SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1994-05-04 EP disclosed