Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | RAB9A | P51151 | 6/20 | 0.54 |
| ▸ | SMN1; SMN2 | Q16637 | 4/20 | 0.54 |
| ▸ | NPC1 | O15118 | 3/20 | 0.54 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.52 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.49 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.45 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.45 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.45 |
| ▸ | MAPT | P10636 | 1/20 | 0.45 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.45 |
| ▸ | CTSB | P07858 | 5/20 | 0.45 |
| ▸ | TOP2A | P11388 | 2/20 | 0.45 |
| ▸ | HPGD | P15428 | 2/20 | 0.44 |
| ▸ | PAK4 | O96013 | 1/20 | 0.44 |
| ▸ | MEN1 | O00255 | 1/20 | 0.44 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.44 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.44 |
| ▸ | PPARG | P37231 | 1/20 | 0.44 |
| ▸ | HTT | P42858 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11890163 | 0.89 | RAB9A (0.45) | RAB9ASMN1; SMN2NPC1HSD17B10HSP90AA1 | |
| SCHEMBL13752162 | 0.80 | RAB9A (0.70) | RAB9ASMN1; SMN2NPC1HSD17B10HSP90AA1 | |
| SCHEMBL5888974 | 0.76 | RAB9A (0.59) | RAB9ASMN1; SMN2NPC1HSD17B10HSP90AA1 | |
| SCHEMBL489903 | 0.74 | RAB9A (0.62) | RAB9ASMN1; SMN2NPC1HSD17B10HSP90AA1 | |
| SCHEMBL81224 | 0.72 | CXCL12 (0.43) | SMN1; SMN2HSD17B10ALDH1A1CYP1A2MAPT | |
| SCHEMBL14589691 | 0.72 | CALM1 (0.42) | RAB9ANPC1ALDH1A1CYP1A2CYP3A4 | |
| SCHEMBL11615149 | 0.72 | RAB9A (0.59) | RAB9ASMN1; SMN2NPC1HSD17B10HSP90AA1 | |
| SCHEMBL28853540 | 0.71 | RAB9A (0.64) | RAB9ASMN1; SMN2NPC1HSD17B10HSP90AA1 | |
| SCHEMBL10975367 | 0.70 | HSD17B10 (0.66) | RAB9ASMN1; SMN2NPC1HSD17B10HSP90AA1 | |
| SCHEMBL5450296 | 0.70 | RAB9A (0.68) | RAB9ASMN1; SMN2NPC1HSD17B10HSP90AA1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 555 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12422750-B2 | Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device | FUJIFILM CORPORATION (JP) | 2025-09-23 | — | — | US | disclosed |
| CN-116648313-B | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2025-05-16 | — | — | CN | disclosed |
| CN-119937247-A | Curable resin composition, resin film, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2025-05-06 | — | — | CN | disclosed |
| CN-115190891-B | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2024-10-15 | — | — | CN | disclosed |
| CN-114981360-B | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2024-09-10 | — | — | CN | disclosed |
| CN-115667404-B | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-117378044-A | Polyimide-containing part forming composition, method for producing bonded body, method for producing device, and device | 富士胶片株式会社 | 2024-01-09 | — | — | CN | disclosed |
| CN-117203746-A | Method for manufacturing bonded body, method for manufacturing semiconductor device, and resin composition | 富士胶片株式会社 | 2023-12-08 | — | — | CN | disclosed |
| CN-117120550-A | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2023-11-24 | — | — | CN | disclosed |
| CN-117043273-A | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2023-11-10 | — | — | CN | disclosed |
| US-20030172828-A1 | Regenerative plate making and printing process, and plate making and printing apparatus | MITSUBISHI HEAVY INDUSTRIES PRINTING & PACKAGING MACHINERY, LTD. (JP) | 2003-09-18 | — | — | US | disclosed |
| EP-1287986-A1 | METHOD AND DEVICE FOR REGENERATIVE PROCESSING AND PRINTING | MITSUBISHI CHEMICAL CORPORATION (JP) | 2003-03-05 | — | — | EP | disclosed |
| US-20020177071-A1 | Method for forming image and apparatus for forming image | MITSUBISHI CHEMICAL CORPORATION (JP) | 2002-11-28 | — | — | US | disclosed |
| EP-1243412-A1 | Method for forming image and apparatus for forming image | MITSUBISHI CHEMICAL CORPORATION (JP) | 2002-09-25 | — | — | EP | disclosed |
| US-20020114966-A1 | Photopolymerizable composition and photopolmerizable lithographic printing plate | MITSUBISHI CHEMICAL CORPORATION (JP) | 2002-08-22 | — | — | US | disclosed |
| US-6153356-A | MIXTURE OF UNSATURATED COMPOUND, CYANINE DYE AND PHOTOINITIATOR | MITSUBISHI CHEMICAL CORPORATION (JP) | 2000-11-28 | — | — | US | disclosed |
| EP-0557555-B1 | Photopolymerizable composition | MITSUBISHI CHEM CORP (JP) | 1995-09-20 | — | — | EP | disclosed |
| EP-0557555-A1 | Photopolymerizable composition | Mitsubishi Chemical Corporation (JP) | 1993-09-01 | — | — | EP | disclosed |
| US-5219709-A | Addition polymerizable unsaturated compound, photoinitiator system of squarylium dye and halomethyl-s-triazine compound | MITSUBISHI KASEI CORPORATION (JP) | 1993-06-15 | — | — | US | disclosed |
| EP-0379200-A2 | Photopolymerizable composition | MITSUBISHI KASEI CORPORATION (JP) | 1990-07-25 | — | — | EP | disclosed |