SCHEMBL825541

SCHEMBL825541

CCC(C)C(=O)Oc1cccc(C(=O)c2ccccc2)c1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ELANE P08246 4/20 0.54
PTGS1 P23219 3/20 0.49
PTGS2 P35354 3/20 0.49
STS P08842 1/20 0.48
L3MBTL1 Q9Y468 3/20 0.47
ATM Q13315 1/20 0.47
TDP1 Q9NUW8 1/20 0.47
LMNA P02545 2/20 0.47
MAPK1 P28482 2/20 0.47
SRD5A2 P31213 1/20 0.47
MAPT P10636 2/20 0.47
CXCR1 P25024 2/20 0.47
CXCR2 P25025 2/20 0.47
SMN1; SMN2 Q16637 2/20 0.47
ALDH1A1 P00352 2/20 0.47
RECQL P46063 1/20 0.47
KDM4E B2RXH2 1/20 0.47
CYP3A4 P08684 1/20 0.47
HPGD P15428 1/20 0.47
PMP22 Q01453 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14998124 0.88 KMT2A (0.55) MAPTSMN1; SMN2RAB9A
SCHEMBL825513 0.87 MAPT (0.49) ELANETDP1MAPK1MAPTSMN1; SMN2
SCHEMBL825544 0.87 ELANE (0.71) ELANEL3MBTL1LMNAMAPK1MAPT
SCHEMBL825491 0.86 KMT2A (0.53) ELANEL3MBTL1TDP1LMNAMAPT
SCHEMBL24250565 0.85 ELANE (0.73) ELANEPTGS1PTGS2STSL3MBTL1
SCHEMBL17138193 0.85 KMT2A (0.47) L3MBTL1ATMTDP1LMNAMAPK1
SCHEMBL650639 0.83 ELANE (0.50) ELANEL3MBTL1ATMTDP1LMNA
SCHEMBL14996055 0.83 ELANE (0.50) ELANEL3MBTL1ATMTDP1LMNA
SCHEMBL17617137 0.83 ELANE (0.50) ELANEL3MBTL1ATMTDP1LMNA
SCHEMBL825480 0.82 RXRA (0.52) PTGS2MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12018107-B2 Polymer material, composition, and method of manufacturing semiconductor device KIOXIA CORPORATION (JP) 2024-06-25 US disclosed
US-8142977-B2 mixture of resin which decomposes under acid under exposure to actinic radiation, acid generator FUJIFILM CORPORATION (JP) 2012-03-27 US disclosed
US-20080241749-A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2008-10-02 US disclosed