SCHEMBL833877

SCHEMBL833877

Oc1ccc(C(c2ccccc2)c2ccc(O)c(F)c2)cc1F

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SHBG P04278 1/20 0.47
GRIN2B Q13224 6/20 0.43
NR3C1 P04150 4/20 0.40
PGR P06401 2/20 0.40
AR P10275 2/20 0.40
CYP17A1 P05093 1/20 0.40
HSD17B1 P14061 1/20 0.39
HSD17B2 P37059 1/20 0.39
HDAC1 Q13547 1/20 0.39
HDAC8 Q9BY41 1/20 0.39
HDAC6 Q9UBN7 1/20 0.39
SLC6A2 P23975 1/20 0.39
SLC6A4 P31645 1/20 0.39
SLC6A3 Q01959 1/20 0.39
MGLL Q99685 1/20 0.38
HKDC1 Q2TB90 1/20 0.38
KDM4E B2RXH2 1/20 0.38
LMNA P02545 1/20 0.38
HSD17B10 Q99714 1/20 0.38
GRIN1 Q05586 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27620448 1.00 SHBG (0.47) SHBGGRIN2BNR3C1PGRAR
SCHEMBL29948191 1.00 SHBG (0.47) SHBGGRIN2BNR3C1PGRAR
SCHEMBL1596219 0.92 SHBG (0.53) SHBGGRIN2BCYP17A1HSD17B1HSD17B2
SCHEMBL4471795 0.89 SHBG (0.55) SHBGGRIN2BCYP17A1HSD17B1HSD17B2
SCHEMBL25121951 0.86 SHBG (0.49) SHBGGRIN2BCYP17A1HSD17B1HSD17B2
SCHEMBL29948072 0.86 SHBG (0.49) SHBGGRIN2BCYP17A1HSD17B1HSD17B2
SCHEMBL835607 0.86 SHBG (0.49) SHBGGRIN2BCYP17A1HSD17B1HSD17B2
SCHEMBL19806918 0.81 ALOX5 (0.46) HDAC1HDAC8HDAC6SLC6A2SLC6A4
SCHEMBL22867985 0.81 SHBG (0.45) SHBGGRIN2BNR3C1PGRAR
SCHEMBL836444 0.79 SLC6A2 (0.41) GRIN2BHDAC1HDAC8HDAC6SLC6A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 92 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3904079-B1 GAS BARRIER LAMINATE LINTEC CORP (JP) 2025-10-29 EP disclosed
CN-115335224-B Laminate for transparent conductive film, and method for producing transparent conductive film 琳得科株式会社 2025-01-03 CN disclosed
US-20240101859-A1 RESIN COMPOSITION FOR COATING, POLYMER, METHOD FOR PRODUCING POLYMER, COATING FILM, AND METHOD FOR MANUFACTURING THE SAME FUJIFILM CORPORATION (JP) 2024-03-28 US disclosed
CN-117242145-A Resin composition for coating, polymer, method for producing polymer, coating film, and method for producing coating film 富士胶片株式会社 2023-12-15 CN disclosed
CN-117203294-A Resin composition for coating, polymer, method for producing polymer, coating film, and method for producing coating film 富士胶片株式会社 2023-12-08 CN disclosed
CN-117062716-A Laminate body 琳得科株式会社 2023-11-14 CN disclosed
CN-116890497-A Laminate, transparent conductive film, and method for producing transparent conductive film 琳得科株式会社 2023-10-17 CN disclosed
CN-113226746-B Gas barrier laminate 琳得科株式会社 2023-08-11 CN disclosed
CN-113226750-B Gas barrier laminate 琳得科株式会社 2023-05-19 CN disclosed
EP-4169711-A1 OPTICAL FILM, OPTICAL FILM MANUFACTURING METHOD, TRANSPARENT CONDUCTIVE FILM, AND GAS BARRIER FILM LINTEC CORPORATION (JP) 2023-04-26 EP disclosed
US-20030013836-A1 Resin composition and articles molded therefrom TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2003-01-16 US disclosed
EP-1270646-A1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-01-02 EP disclosed
EP-0852342-B1 Coating liquid composition for photosensitive member for electrophotography and method of manufacturing photosensitive member for elelctrophotography using same SHARP KK (JP) 2002-02-27 EP disclosed
US-6235842-B1 USEFUL AS ADHESIVES, FILM MATERIALS, AND MOLDING MATERIALS FOR ENCAPSULATING ELECTRONIC COMPONENTS. HITACHI CHEMICAL COMPANY, LTD. (JP) 2001-05-22 US disclosed
EP-0979854-A1 CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-02-16 EP disclosed
US-5952146-A COMPRISING AN ORGANIC PHOTOCONDUCTIVE COMPOUND AND A BINDER RESIN WHICH ARE DISSOLVED OR DISPERSED IN A SOLVENT, CONTAINING AN ALIPHATIC UNSATURATED HYDROCARBON HAVING 5 TO 8 CARBON ATOMS SHARP KABUSHIKI KAISHA (JP) 1999-09-14 US disclosed
US-5902872-A POLYARYLATE COMPRISING 2,2-BIS/3-METHYL-4-HYDROXYPHENYL/PROPANE UNITS, TEREPHTHALIC ACID UNITS AND ISOPHTHALIC ACID UNITS, HAVING SPECIFIED INHERENT VISCOSITY UNITIKA, LTD. (JP) 1999-05-11 US disclosed
EP-0884342-A1 Resin for coating formation and method for producing the same UNITIKA LTD. (JP) 1998-12-16 EP disclosed
EP-0852342-A1 Coating liquid composition for photosensitive member for electrophotography and method of manufacturing photosensitive member for elelctrophotography using same SHARP KABUSHIKI KAISHA (JP) 1998-07-08 EP disclosed
US-5763126-A INCLUDING BINDER RESIN HAVING NO OR ONE GLASS TRANSITION POINT; DURABLE, WEAR RESISTANT SHARP KABUSHIKI KAISHA (JP) 1998-06-09 US disclosed