SCHEMBL835192

SCHEMBL835192

Cc1cc(O)c(C)c(C)c1C(c1ccccc1)c1c(C)cc(O)c(C)c1C

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC6A2 P23975 2/20 0.37
SLC6A4 P31645 2/20 0.37
SLC6A3 Q01959 2/20 0.37
LMNA P02545 2/20 0.37
HTT P42858 1/20 0.37
TYR P14679 1/20 0.36
GAA P10253 1/20 0.36
HKDC1 Q2TB90 1/20 0.36
MEN1 O00255 3/20 0.35
KMT2A Q03164 3/20 0.35
NQO1 P15559 2/20 0.35
MAPT P10636 2/20 0.35
MAPK1 P28482 2/20 0.35
NPSR1 Q6W5P4 2/20 0.35
POLB P06746 2/20 0.35
RECQL P46063 1/20 0.35
BLM P54132 1/20 0.35
SAE1 Q9UBE0 1/20 0.35
UBA2 Q9UBT2 1/20 0.35
ALDH1A1 P00352 3/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4058120 0.85 ESR1 (0.39) SLC6A2SLC6A3LMNAGAAMEN1
SCHEMBL4062276 0.85 KMT2A (0.40) SLC6A2LMNAGAAMEN1KMT2A
SCHEMBL30375425 0.80 GABRA1 (0.44) LMNAHTTGAAMEN1KMT2A
SCHEMBL2863828 0.80 GABRA1 (0.44) LMNAHTTGAAMEN1KMT2A
SCHEMBL4055736 0.80 MAPT (0.54) GAAMEN1KMT2ANQO1MAPT
SCHEMBL15135049 0.79 ESR2 (0.42) SLC6A2SLC6A4SLC6A3LMNATYR
SCHEMBL4055507 0.75 CA1 (0.43) LMNAHTTTYRMEN1KMT2A
SCHEMBL7659656 0.74 SLC6A2 (0.50) SLC6A2SLC6A4SLC6A3LMNAHTT
SCHEMBL9039823 0.74 GAA (0.41) SLC6A2SLC6A4SLC6A3LMNAGAA
SCHEMBL8070036 0.74 TRPA1 (0.42) SLC6A2LMNAHTTTYRGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3904079-B1 GAS BARRIER LAMINATE LINTEC CORP (JP) 2025-10-29 EP disclosed
CN-115335224-B Laminate for transparent conductive film, and method for producing transparent conductive film 琳得科株式会社 2025-01-03 CN disclosed
CN-117062716-A Laminate body 琳得科株式会社 2023-11-14 CN disclosed
CN-116890497-A Laminate, transparent conductive film, and method for producing transparent conductive film 琳得科株式会社 2023-10-17 CN disclosed
US-11767452-B2 Curable composition, especially as crystallizing rubber to substrate bonding primer HENKEL AG & CO. KGAA (DE) 2023-09-26 US disclosed
CN-113226746-B Gas barrier laminate 琳得科株式会社 2023-08-11 CN disclosed
CN-113226750-B Gas barrier laminate 琳得科株式会社 2023-05-19 CN disclosed
EP-4169711-A1 OPTICAL FILM, OPTICAL FILM MANUFACTURING METHOD, TRANSPARENT CONDUCTIVE FILM, AND GAS BARRIER FILM LINTEC CORPORATION (JP) 2023-04-26 EP disclosed
WO-2023054528-A1 LAMINATE リンテック株式会社 2023-04-06 WO disclosed
CN-115734875-A Optical film, method for producing optical film, transparent conductive film, and gas barrier film 琳得科株式会社 2023-03-03 CN disclosed
US-20080054225-A1 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer HITACHI CHEMICAL CO., LTD. (JP) 2008-03-06 US disclosed
US-20070299172-A1 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer HITACHI CHEMICAL CO., LTD. (JP) 2007-12-27 US disclosed
US-20070040153-A1 Film for anisotropic conductivity and electronic circuits and devices using the film CHEIL INDUSTRIES, INC. (KR) 2007-02-22 US disclosed
US-20060148956-A1 Anisotropic conductive film forming composition KUKDO CHEMICAL CO., LTD. (KR) 2006-07-06 US disclosed
US-20060060969-A1 Electronic circuit including circuit-connecting material HITACHI CHEMICAL CO., LTD. (JP) 2006-03-23 US disclosed
US-20060063366-A1 Circuit-connecting material and circuit terminal connected structure and connecting method HITACHI CHEMICAL CO., LTD. (JP) 2006-03-23 US disclosed
US-20060014860-A1 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer HITACHI CHEMICAL CO., LTD. (JP) 2006-01-19 US disclosed
US-20040222408-A1 SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE HITACHI CHEMICAL COMPANY, LTD. (JP) 2004-11-11 US disclosed
US-6235842-B1 USEFUL AS ADHESIVES, FILM MATERIALS, AND MOLDING MATERIALS FOR ENCAPSULATING ELECTRONIC COMPONENTS. HITACHI CHEMICAL COMPANY, LTD. (JP) 2001-05-22 US disclosed
EP-0979854-A1 CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-02-16 EP disclosed