SCHEMBL8364737

SCHEMBL8364737

CCCO[SiH](OCCC)c1cccc(N)c1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.44
CYP3A4 P08684 3/20 0.42
TP53 P04637 2/20 0.42
ALDH1A1 P00352 6/20 0.39
KDM4E B2RXH2 3/20 0.39
CASP1 P29466 2/20 0.39
KMT2A Q03164 2/20 0.39
MEN1 O00255 1/20 0.39
USP2 O75604 1/20 0.39
POLB P06746 1/20 0.39
GAA P10253 1/20 0.39
MAPT P10636 1/20 0.39
HTT P42858 1/20 0.39
CASP7 P55210 1/20 0.39
ATM Q13315 1/20 0.39
RECQL P46063 1/20 0.38
CA12 O43570 1/20 0.36
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
CA7 P43166 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8953958 0.90 TSHR (0.49) TSHRCYP3A4TP53ALDH1A1KDM4E
SCHEMBL2950776 0.87 KMT2A (0.37) TSHRALDH1A1KMT2AMEN1
SCHEMBL1172588 0.85 CYP3A4 (0.48) TSHRCYP3A4TP53ALDH1A1KDM4E
SCHEMBL15736418 0.79 ACHE (0.36) KMT2AMAOB
SCHEMBL8953992 0.77 TSHR (0.41) TSHRCYP3A4TP53ALDH1A1KDM4E
SCHEMBL313696 0.77 LMNA (0.44) TSHRCYP3A4TP53ALDH1A1KMT2A
SCHEMBL959416 0.75 ALDH1A1 (0.48) TSHRCYP3A4TP53ALDH1A1KDM4E
SCHEMBL3337785 0.75 LTA4H (0.46) TSHRALDH1A1KDM4EKMT2AGAA
SCHEMBL29563626 0.75 KMT2A (0.36) ALDH1A1KMT2ASMN1; SMN2
SCHEMBL15736499 0.75 ALDH1A1 (0.42) TSHRALDH1A1KMT2AMEN1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0601203-B1 PHOTOSENSITIVE RESIN COMPOSITION CHISSO CORP (JP) 1999-09-29 EP disclosed
EP-0546814-B1 A polyimide photosensitive cover coating agent CHISSO CORP (JP) 1997-09-17 EP disclosed
US-5589319-A FLUORINE-CONTAINING POLYIMIDE, ISOCYANURATE HAVING A (METH)ACRYLIC GROUP, POLYALKYLENE GLYCOL DI(METH)ACRYLATE, AND PHOTOPOLYMERIZATION INITIATOR CHISSO CORPORATION (JP) 1996-12-31 US disclosed
US-5536584-A SEMICONDUCTOR INTEGRATED CIRCUIT, TRANSISTOR AND A THIN FILM MULTILEVEL WIRING BOARD USES SURFACE PROTECTIVE COATING OF POLYIMIDE HITACHI, LTD. (JP) 1996-07-16 US disclosed
US-5326792-A Protective coatings for flexibile circuits CHISSO CORPORATION (JP) 1994-07-05 US disclosed
EP-0601203-A1 PHOTOSENSITIVE RESIN COMPOSITION CHISSO CORPORATION (JP) 1994-06-15 EP disclosed
US-5300627-A Heat resistant silicon modified polyimide CHISSO CORPORATION (JP) 1994-04-05 US disclosed
US-5272247-A Polyimide precursor, cured product thereof, and processes for producing them HITACHI, LTD. (JP) 1993-12-21 US disclosed
EP-0546814-A1 A polyimide photosensitive cover coating agent CHISSO CORPORATION (JP) 1993-06-16 EP disclosed
EP-0538075-A1 Adhesive polyimide film CHISSO CORPORATION (JP) 1993-04-21 EP disclosed