SCHEMBL8372191

SCHEMBL8372191

CCSc1ccc(S)cc1

nearest known ligand 0.47

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
SLC6A4 P31645 9/20 0.47
MAOA P21397 2/20 0.47
GSK3B P49841 1/20 0.38
RAB9A P51151 2/20 0.36
NPC1 O15118 1/20 0.36
GAA P10253 1/20 0.33
IDO1 P14902 1/20 0.33
TAS1R3 Q7RTX0 1/20 0.33
TAS1R1 Q7RTX1 1/20 0.33
GRK6 P43250 1/20 0.33
SLC2A1 P11166 1/20 0.32
CA12 O43570 1/20 0.32
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
CA7 P43166 1/20 0.32
CA13 Q8N1Q1 1/20 0.32
MAOB P27338 1/20 0.31
ALDH1A1 P00352 1/20 0.31
MAPK1 P28482 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10525886 0.93 SLC6A4 (0.43) SLC6A4MAOAGSK3BRAB9ANPC1
SCHEMBL3947933 0.89 CA2 (0.41) SLC6A4MAOARAB9ANPC1CA2
SCHEMBL22068903 0.87 ALDH1A1 (0.44) SLC6A4MAOAGSK3BRAB9ANPC1
SCHEMBL346860 0.86 SLC6A4 (0.56) SLC6A4MAOAGSK3BRAB9ANPC1
SCHEMBL14139449 0.84 GSK3B (0.41) SLC6A4MAOAGSK3BRAB9ANPC1
SCHEMBL22068902 0.82 ALDH1A1 (0.41) SLC6A4MAOARAB9ANPC1ALDH1A1
SCHEMBL5609306 0.79 SLC6A4 (0.47) SLC6A4MAOAGSK3BRAB9ANPC1
SCHEMBL10532807 0.78 SLC2A1 (0.46) SLC6A4MAOARAB9ANPC1SLC2A1
SCHEMBL10316183 0.78 SLC6A4 (0.50) SLC6A4MAOAGSK3BRAB9ANPC1
SCHEMBL9793575 0.78 SLC6A4 (0.50) SLC6A4MAOAGSK3BRAB9ANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 59 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250189895-A1 METHOD OF MANUFACTURING PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-06-12 US disclosed
US-20250172872-A1 CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE COMPOSITION, METHOD OF MANUFACTURING SUBSTRATE WITH TEMPLATE, AND METHOD OF MANUFACTURING PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-05-29 US disclosed
CN-119620544-A Photosensitive resin composition, dry film, photosensitive dry film, resist film, molded substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2025-03-14 CN disclosed
CN-118829948-A Method for manufacturing plating shaped article 东京应化工业株式会社 2024-10-22 CN disclosed
CN-118742854-A Chemically amplified positive photosensitive composition, method for producing molded substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2024-10-01 CN disclosed
US-20240053680-A1 PHOTOSENSITIVE DRY FILM, LAMINATED FILM, METHOD FOR PRODUCING LAMINATED FILM, AND METHOD FOR PRODUCING PATTERNED RESIST FILM TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-15 US disclosed
CN-110647010-B Resin composition, dry film, method for producing dry film, resist film, substrate, and method for producing plating molded article 东京应化工业株式会社 2024-02-09 CN disclosed
US-11803122-B2 Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-31 US disclosed
US-11754926-B2 Method of forming resist pattern, resist composition and method of producing the same TOKYO OHKA KOGYO CO., LTD. (JP) 2023-09-12 US disclosed
WO-2023162551-A1 METHOD FOR PRODUCING PLATED SHAPED ARTICLE 東京応化工業株式会社 2023-08-31 WO disclosed
US-20170309468-A1 CLEANING SOLUTION, METHOD OF REMOVING A REMOVAL TARGET AND METHOD OF ETCHING A SUBSTRATE USING SAID CLEANING SOLUTION TOKYO OHKA KOGYO CO LTD (JP) 2017-10-26 US disclosed
US-20160208201-A1 CLEANING LIQUID FOR LITHOGRAPHY AND METHOD FOR FORMING WIRING TOKYO OHKA KOGYO CO LTD (JP) 2016-07-21 US disclosed
US-9250534-B2 Nonaqueous cleaning liquid and method for etching processing of silicon substrate TOKYO OHKA KOGYO CO., LTD. (JP) 2016-02-02 US disclosed
US-8802610-B2 Cleaning liquid and anticorrosive agent comprising a mercapto compound and solvent TOKYO OHKA KOGYO CO., LTD. (JP) 2014-08-12 US disclosed
US-20140018281-A1 CLEANING LIQUID AND ANTICORROSIVE AGENT TOKYO OHKA KOGYO CO., LTD. (JP) 2014-01-16 US disclosed
US-20140017902-A1 NONAQUEOUS CLEANING LIQUID AND METHOD FOR ETCHING PROCESSING OF SILICON SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2014-01-16 US disclosed
US-20130330927-A1 CLEANING LIQUID FOR LITHOGRAPHY AND METHOD FOR FORMING WIRING TOKYO OHKA KOGYO CO., LTD. (JP) 2013-12-12 US disclosed
US-20130172224-A1 CLEANING LIQUID, AND ANTICORROSIVE AGENT TOKYO OHKA KOGYO CO., LTD. (JP) 2013-07-04 US disclosed
EP-0889718-A1 KERATIN FIBRE DYE COMPOSITIONS CONTAINING PYRROLO-AZOLE COMPOUNDS, USE THEREOF AS COUPLERS, AND DYEING METHOD L'OREAL (FR) 1999-01-13 EP disclosed
WO-1997035554-A1 KERATIN FIBRE DYE COMPOSITIONS CONTAINING PYRROLO-AZOLE COMPOUNDS, USE THEREOF AS COUPLERS, AND DYEING METHOD L'OREAL (FR) 1997-10-02 WO disclosed