SCHEMBL8514633

SCHEMBL8514633

N#Cc1ccc(S(=O)(=O)c2ccc(C#N)cc2)cc1

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA2 P00918 7/20 0.59
CA1 P00915 6/20 0.59
CA9 Q16790 4/20 0.59
CA12 O43570 3/20 0.59
CYP19A1 P11511 1/20 0.52
BCHE P06276 1/20 0.49
ACHE P22303 1/20 0.49
MAOA P21397 2/20 0.47
MAOB P27338 2/20 0.47
IDO1 P14902 1/20 0.47
PTGS2 P35354 1/20 0.47
MAPT P10636 1/20 0.47
ALDH1A1 P00352 2/20 0.46
CYP3A4 P08684 2/20 0.46
CYP2A6 P11509 1/20 0.46
CA3 P07451 1/20 0.46
CA6 P23280 1/20 0.46
CA14 Q9ULX7 1/20 0.46
MAPK1 P28482 1/20 0.46
LMNA P02545 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL161783 0.91 HTR6 (0.61) CA2CA1CA9CA12CYP19A1
SCHEMBL29337050 0.89 IDO1 (0.62) CA2CA1CA9CA12CYP19A1
SCHEMBL7935644 0.89 CA2 (0.67) CA2CA1CA9CA12CYP19A1
SCHEMBL160164 0.89 CA1 (0.50) CA2CA1CA9CA12CYP19A1
SCHEMBL14378095 0.89 ALDH1A1 (0.67) CA2CA1CA9CA12BCHE
SCHEMBL9192027 0.89 CA1 (0.50) CA2CA1CA9CA12CYP19A1
SCHEMBL9192526 0.89 CA1 (0.50) CA2CA1CA9CA12CYP19A1
SCHEMBL20379869 0.89 HTR6 (0.67) CA2CA1CA9CA12CYP19A1
SCHEMBL29032533 0.87 CA1 (0.53) CA2CA1CA9CA12CYP19A1
SCHEMBL20380311 0.84 KCNJ1 (0.51) CA2CA1CA9CA12MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4448940-A POLYOXAZOLINES BASED ON DINITRILES AND DIEPOXY COMPOUNDS; POLYISOCYANURATE; FLEXIBILITY; PRINTED CIRCUITS HITACHI, LTD. (JP) 1984-05-15 US claimed
CN-120092029-A Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board 三菱瓦斯化学株式会社 2025-06-03 CN disclosed
CN-116457417-B Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board 三菱瓦斯化学株式会社 2025-02-14 CN disclosed
CN-114650979-B Compound, mixture, curable resin composition, cured product thereof, and method for producing compound 日本化药株式会社 2024-09-17 CN disclosed
CN-116438244-B Crosslinkable organosiloxanes alkane modified reaction resins 瓦克化学股份公司 2024-08-30 CN disclosed
CN-114845874-B Resin sheet and printed circuit board 三菱瓦斯化学株式会社 2024-08-23 CN disclosed
CN-114787120-B Compound and method for producing same, resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-08-09 CN disclosed
CN-118251445-A Cyclic organosiloxane containing imide bond and polymerizable unsaturated bond and curable resin composition containing the same 信越化学工业株式会社 2024-06-25 CN disclosed
CN-118234802-A Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board 三菱瓦斯化学株式会社 2024-06-21 CN disclosed
CN-112236464-B Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2024-02-23 CN disclosed
EP-2457651-B1 CHEMICAL REACTOR AND ITS USAGE IN CHEMICAL REACTION BEIJING SIJIANTONG TECHNOLOGY & DEV CO LTD (CN) 2015-05-20 EP disclosed
US-20120186972-A1 CHEMICAL REACTOR AND ITS USAGE IN CHEMICAL REACTION BEIJING SIJIANTONG TECHNOLOGY & DEVELOPMENT CO., LTD. (CN) 2012-07-26 US disclosed
EP-2457651-A1 CHEMICAL REACTOR AND ITS USAGE IN CHEMICAL REACTION Beijing Sijiantong Technology&Development Co., Ltd (CN) 2012-05-30 EP disclosed
CN-101189316-A Reinforced pad 3M INNOVATIVE PROPERTIES CO (US) 2008-05-28 CN disclosed
EP-0594644-B1 ANISOTROPIC CONDUCTIVE ADHESIVE FILM MINNESOTA MINING & MFG (US) 1997-03-12 EP disclosed
EP-0594644-A1 ANISOTROPIC CONDUCTIVE ADHESIVE FILM. MINNESOTA MINING & MFG (US) 1994-05-04 EP disclosed
WO-1993001248-A1 ANISOTROPIC CONDUCTIVE ADHESIVE FILM MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1993-01-21 WO disclosed
EP-0078503-B1 THERMOSETTING RESIN COMPOSITION AND PREPOLYMER THEREOF Hitachi, Ltd. (JP) 1986-02-26 EP disclosed
US-4448940-A POLYOXAZOLINES BASED ON DINITRILES AND DIEPOXY COMPOUNDS; POLYISOCYANURATE; FLEXIBILITY; PRINTED CIRCUITS HITACHI, LTD. (JP) 1984-05-15 US disclosed
EP-0078503-A1 Thermosetting resin composition and prepolymer thereof Hitachi, Ltd. (JP) 1983-05-11 EP disclosed