⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20524986 | 0.82 | CYP2A6 (0.32) | — | |
| SCHEMBL64917 | 0.78 | CYP1A2 (0.40) | — | |
| SCHEMBL705487 | 0.78 | — | — | |
| SCHEMBL5227738 | 0.78 | CYP1A2 (0.40) | — | |
| SCHEMBL3237917 | 0.78 | CA1 (0.30) | — | |
| SCHEMBL16593572 | 0.78 | — | — | |
| SCHEMBL328780 | 0.75 | LTA4H (0.42) | — | |
| SCHEMBL3246397 | 0.75 | KDM4E (0.37) | — | |
| SCHEMBL10757073 | 0.75 | CA1 (0.33) | — | |
| SCHEMBL2500175 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0408990-B1 | Thermosetting reaction resin mixture | SIEMENS AG (DE) | 1998-03-11 | — | — | EP | claimed |
| EP-0612778-B1 | Epoxy resin composition | BAKELITE AG (DE) | 1997-04-16 | — | — | EP | claimed |
| US-5458978-A | Halogen-free, inflammability | RUTGERSWERKE ATKIENGESELLSCHAFT AG (DE) | 1995-10-17 | — | — | US | claimed |
| US-5364893-A | Hydrogenated aromatic diisocyanate trimer curing agent | SIEMENS AKTIENGESELLSCHAFT (DE) | 1994-11-15 | — | — | US | claimed |
| EP-0612778-A1 | Epoxy resin composition | Bakelite AG (DE) | 1994-08-31 | — | — | EP | claimed |
| EP-0384939-B1 | Epoxy resin moulding compositions | SIEMENS AG (DE) | 1994-06-22 | — | — | EP | claimed |
| EP-0384940-B1 | Epoxy resin compositions | SIEMENS AG (DE) | 1994-06-22 | — | — | EP | claimed |
| US-5036135-A | Comprising a phosphorus-free diepoxide, an epoxy-group-contai ning phosphorus compound, a diisocyanate, a curing catalyst an d filler; nonflammable molding materials | SIEMENS AKTIENGESELLSCHAFT (DE) | 1991-07-30 | — | — | US | claimed |
| EP-0408990-A2 | Thermosetting reaction resin mixture | SIEMENS AKTIENGESELLSCHAFT (DE) | 1991-01-23 | — | — | EP | claimed |
| EP-0384940-A1 | Epoxy resin compositions | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-09-05 | — | — | EP | claimed |
| EP-0384939-A1 | Epoxy resin moulding compositions | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-09-05 | — | — | EP | claimed |
| JP-3059018-A | — | — | None | — | — | JP | disclosed |
| EP-0408990-B1 | Thermosetting reaction resin mixture | SIEMENS AG (DE) | 1998-03-11 | — | — | EP | disclosed |
| EP-0612778-B1 | Epoxy resin composition | BAKELITE AG (DE) | 1997-04-16 | — | — | EP | disclosed |
| US-5458978-A | Halogen-free, inflammability | RUTGERSWERKE ATKIENGESELLSCHAFT AG (DE) | 1995-10-17 | — | — | US | disclosed |
| EP-0384940-A1 | Epoxy resin compositions | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-09-05 | — | — | EP | disclosed |
| EP-0384939-A1 | Epoxy resin moulding compositions | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-09-05 | — | — | EP | disclosed |
| EP-0067032-B1 | POLY(ESTER-AMIDE) CAPABLE OF FORMING AN ANISOTROPIC MELT PHASE DERIVED FROM P-HYDROXYBENZOIC ACID, 2,6-DIHYDROXYNAPHTHALENE, CARBOCYCLIC DICARBOXYLIC ACID, AROMATIC MONOMER CAPABLE OF FORMING AN AMIDE LINKAGE AND, OPTINALLY, ADDITIONAL AROMATIC DIOL | CELANESE CORPORATION (US) | 1985-09-18 | — | — | EP | disclosed |
| EP-0067032-A1 | Poly(ester-amide) capable of forming an anisotropic melt phase derived from p-hydroxybenzoic acid, 2,6-dihydroxynaphthalene, carbocyclic dicarboxylic acid, aromatic monomer capable of forming an amide linkage and, optinally, additional aromatic diol | CELANESE CORPORATION (US) | 1982-12-15 | — | — | EP | disclosed |
| US-4339375-A | Poly(ester-amide) capable of forming an anisotropic melt phase derived from p-hydroxybenzoic acid, 2,6-dihydroxynaphthalene, carbocyclic dicarboxylic acid, aromatic monomer capable of forming an amide linkage, and, optionally, additional aromatic diol | CELANESE CORPORATION (US) | 1982-07-13 | — | — | US | disclosed |