SCHEMBL8564678

SCHEMBL8564678

Cc1ccccc1Oc1ccc(N)cc1.O=C1C=CC(=O)N1.O=C1C=CC(=O)N1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.48
SMN1; SMN2 Q16637 3/20 0.48
CYP1A2 P05177 1/20 0.48
CYP2C9 P11712 1/20 0.48
HPGD P15428 1/20 0.48
CYP2C19 P33261 1/20 0.48
MMP14 P50281 2/20 0.46
NCOA1 Q15788 1/20 0.44
NCOA3 Q9Y6Q9 1/20 0.44
MMP13 P45452 1/20 0.43
MAOA P21397 1/20 0.42
EZH2 Q15910 1/20 0.41
TEAD4 Q15561 1/20 0.41
TDP1 Q9NUW8 2/20 0.40
POLB P06746 1/20 0.40
MAPT P10636 1/20 0.40
TSHR P16473 2/20 0.38
CYP3A4 P08684 1/20 0.38
LTA4H P09960 1/20 0.38
BCAT2 O15382 3/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29553309 0.85 ALDH1A1 (0.60) ALDH1A1SMN1; SMN2CYP1A2CYP2C9HPGD
SCHEMBL554682 0.85 ALDH1A1 (0.60) ALDH1A1SMN1; SMN2CYP1A2CYP2C9HPGD
SCHEMBL8565101 0.76 ALDH1A1 (0.40) ALDH1A1SMN1; SMN2HPGDTEAD4TDP1
SCHEMBL7690257 0.76 ALDH1A1 (0.59) ALDH1A1SMN1; SMN2CYP1A2CYP2C9HPGD
SCHEMBL1270920 0.72 MAOA (0.68) ALDH1A1SMN1; SMN2HPGDNCOA1NCOA3
O-Xylene SCHEMBL20597611 0.72 GSK3B (0.58) ALDH1A1CYP1A2CYP2C19POLBMAPT
SCHEMBL29476109 0.72 MAOA (0.68) ALDH1A1SMN1; SMN2HPGDNCOA1NCOA3
SCHEMBL459355 0.72 MAOA (0.68) ALDH1A1SMN1; SMN2HPGDNCOA1NCOA3
SCHEMBL9858506 0.72 GSK3A (0.65) ALDH1A1CYP2C9TDP1MAPTTSHR
SCHEMBL1978901 0.72 DHFR (0.62) ALDH1A1SMN1; SMN2CYP1A2CYP2C9HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5780145-A CURED EPXOY AND OR IMIDE RESINS WITH FILLERS AND GLOBULAR POWDER WITH SPECIFIC PARTICLE SIZE USED AS A SEALING MATERIALS FOR SEMICONDUCTORS SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1998-07-14 US disclosed