Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL869197 | 0.82 | ELANE (0.31) | — | |
| SCHEMBL8979696 | 0.81 | ATM (0.36) | LMNAMAPTPTPN1 | |
| SCHEMBL9065256 | 0.81 | THRB (0.38) | LMNAMAPTPTPN1 | |
| SCHEMBL869198 | 0.73 | SMN1; SMN2 (0.46) | LMNAMAPT | |
| SCHEMBL3391824 | 0.71 | LMNA (0.52) | LMNAMAPT | |
| SCHEMBL10785859 | 0.68 | THRB (0.36) | — | |
| SCHEMBL11214664 | 0.67 | VDR (0.31) | LMNA | |
| SCHEMBL11212312 | 0.66 | THRB (0.34) | — | |
| SCHEMBL9064851 | 0.65 | ATM (0.40) | LMNAMAPTPTPN1 | |
| SCHEMBL16207462 | 0.65 | MAPT (0.61) | LMNAMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2436715-B1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO KK (JP) | 2016-08-24 | — | — | EP | claimed |
| US-8865801-B2 | Epoxy resin-based coating composition | SHOWA DENKO K.K. (JP) | 2014-10-21 | — | — | US | claimed |
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | claimed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | claimed |
| US-20120077903-A1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO K.K. (JP) | 2012-03-29 | — | — | US | claimed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | claimed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | claimed |
| EP-2436715-B1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO KK (JP) | 2016-08-24 | — | — | EP | disclosed |
| US-8865801-B2 | Epoxy resin-based coating composition | SHOWA DENKO K.K. (JP) | 2014-10-21 | — | — | US | disclosed |
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | disclosed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | disclosed |
| US-20120077903-A1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO K.K. (JP) | 2012-03-29 | — | — | US | disclosed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | disclosed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | disclosed |