Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | AKR1C3 | P42330 | 1/20 | 0.63 |
| ▸ | MRGPRX4 | Q96LA9 | 1/20 | 0.54 |
| ▸ | KMO | O15229 | 1/20 | 0.50 |
| ▸ | TTR | P02766 | 2/20 | 0.49 |
| ▸ | PPARG | P37231 | 1/20 | 0.48 |
| ▸ | NR4A2 | P43354 | 2/20 | 0.48 |
| ▸ | NPC1 | O15118 | 1/20 | 0.47 |
| ▸ | POLB | P06746 | 1/20 | 0.47 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.47 |
| ▸ | RAB9A | P51151 | 1/20 | 0.47 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.47 |
| ▸ | GCK | P35557 | 1/20 | 0.46 |
| ▸ | HDAC8 | Q9BY41 | 1/20 | 0.45 |
| ▸ | F10 | P00742 | 1/20 | 0.45 |
| ▸ | CASP1 | P29466 | 1/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.44 |
| ▸ | KAT6A | Q92794 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29466776 | 0.85 | AKR1C3 (0.79) | AKR1C3MRGPRX4KMOTTRNR4A2 | |
| SCHEMBL1042630 | 0.85 | AKR1C3 (0.79) | AKR1C3MRGPRX4KMOTTRNR4A2 | |
| Hydrochloric Acid SCHEMBL8434547 | 0.84 | AKR1C3 (0.76) | AKR1C3MRGPRX4KMOTTRPPARG | |
| Hydrochloric Acid SCHEMBL8434544 | 0.84 | AKR1C3 (0.76) | AKR1C3MRGPRX4KMOTTRPPARG | |
| SCHEMBL10963567 | 0.83 | CASP1 (0.56) | TTRNPC1POLBRAB9ACASP1 | |
| SCHEMBL27145020 | 0.81 | ALPL (0.44) | POLBGCKCASP1ALDH1A1KMT2A | |
| SCHEMBL146565 | 0.80 | CASP1 (0.50) | CASP1KMT2A | |
| SCHEMBL502864 | 0.80 | CASP1 (0.50) | CASP1KMT2A | |
| SCHEMBL27818369 | 0.80 | AKR1C3 (0.69) | AKR1C3MRGPRX4KMOTTRNR4A2 | |
| SCHEMBL921873 | 0.80 | AKR1C3 (0.69) | AKR1C3MRGPRX4KMOTTRNR4A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113527101-B | Novel compound, polymer, process for producing the same, photosensitive resin composition, pattern forming process, cured film, and electronic component | 信越化学工业株式会社 | 2024-04-23 | — | — | CN | disclosed |
| EP-3896114-B1 | POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHINETSU CHEMICAL CO (JP) | 2023-10-18 | — | — | EP | disclosed |
| US-11572442-B2 | Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2023-02-07 | — | — | US | disclosed |
| CN-113527101-A | Novel compound, polymer and method for producing same, photosensitive resin composition, method for forming pattern, cured film, and electronic component | 信越化学工业株式会社 | 2021-10-22 | — | — | CN | disclosed |
| EP-3896114-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | Shin-Etsu Chemical Co., Ltd. (JP) | 2021-10-20 | — | — | EP | disclosed |
| US-20210317270-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-14 | — | — | US | disclosed |
| US-5594089-A | TOUGH THERMOPLASTIC FOR AEROSPACE APPLICATIONS, POLYAMIDE WITH IMIDE ENDCAPPING | THE BOEING COMPANY | 1997-01-14 | — | — | US | disclosed |
| US-5198526-A | Heterocycle oligomers with multidimensional morphology | THE BOEING COMPANY (US) | 1993-03-30 | — | — | US | disclosed |
| US-5126410-A | Solvent resistant polybenzoxazoles, polybenzothiazoles and polybenzimidazoles | THE BOEING COMPANY (US) | 1992-06-30 | — | — | US | disclosed |
| US-5120819-A | Heat and sovent-resistant polybenzoxazoles,-thiazoles and -imidazoles for aerospace applications | BOEING COMPANY (US) | 1992-06-09 | — | — | US | disclosed |
| US-5082905-A | Blended heterocycles | THE BOEING COMPANY (US) | 1992-01-21 | — | — | US | disclosed |
| US-5066541-A | Heterocycle oligomer blends | THE BOEING COMPANY (US) | 1991-11-19 | — | — | US | disclosed |
| US-4965336-A | PHENYLIMIDE ACID HALIDE ENCAPPED POLYBENZOXAZLES; CURABLE, SOLVENT RESISTANCE PREPREGS | THE BOEING COMPANY (US) | 1990-10-23 | — | — | US | disclosed |
| US-4868270-A | Heterocycle sulfone oligomers and blends | THE BOEING COMPANY (US) | 1989-09-19 | — | — | US | disclosed |
| EP-0311735-A2 | Heterocycle sulfone oligomers and blends | The Boeing Company (US) | 1989-04-19 | — | — | EP | disclosed |
| EP-0309649-A2 | High performance heterocycle oligomers and blends | THE BOEING COMPANY (US) | 1989-04-05 | — | — | EP | disclosed |
| US-4547553-A | CROSSLINKED SOLVENT RESISTANT THERMOPLASTIC RESIN | THE BOEING COMPANY (US) | 1985-10-15 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-11572442-B2 | Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic component | BRIX1, RBX1, HAX1 | AKR1C3 3444/4885MRGPRX4 263/4885KMO 3211/4885 |
| US-20210317270-A1 | NOVEL COMPOUND, POLYIMIDE RESIN AND METHOD OF PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD AND METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | BRIX1, HAX1, RBX1 | AKR1C3 3251/4885MRGPRX4 236/4885KMO 3307/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.