SCHEMBL8755271

SCHEMBL8755271

C=CCC1=NC(=S)N=C1CC=C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9751877 0.74
SCHEMBL15777593 0.72 CYP3A4 (0.31)
SCHEMBL5831274 0.57 ALDH1A1 (0.33)
SCHEMBL11119104 0.57
SCHEMBL3856071 0.57 NPSR1 (0.30)
SCHEMBL456737 0.57 ALDH1A1 (0.33)
SCHEMBL17961910 0.55
SCHEMBL9522589 0.53 ALDH1A1 (0.32)
SCHEMBL7776633 0.53
SCHEMBL10520401 0.51 GABRA1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5091498-A Alkali resistant coatings E. I. DU PONT DE NEMOURS AND COMPANY (US) 1992-02-25 US claimed
EP-0411927-A1 Coating compositions containing 1,3-dialkylimidazole-2-thione catalysts E.I. DU PONT DE NEMOURS AND COMPANY (US) 1991-02-06 EP claimed
EP-0545218-B1 Complexing agent for displacement tin plating ROHCO INC MCGEAN (US) 1997-04-09 EP disclosed
EP-0545218-A2 Complexing agent for displacement tin plating MCGEAN-ROHCO, INC. (US) 1993-06-09 EP disclosed
EP-0545218-A2 Complexing agent for displacement tin plating MCGEAN-ROHCO, INC. (US) 1993-06-09 EP disclosed
US-5196053-A An imidazole-2-thione, copper coated printed circuits MCGEAN-ROHCO, INC. (US) 1993-03-23 US disclosed