Diphenylmethane

Diphenylmethane

SCHEMBL8779570

[Cl-].[Cl-].[Zr+2]C1c2ccccc2-c2cccc(C3=CC=CC3)c21.c1ccc(Cc2ccccc2)cc1

nearest known ligand 0.33

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Diphenylmethane. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
MAPT P10636 1/20 0.33
CALM1 P0DP23 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL524857 0.91 GPR3 (0.30)
Iodide SCHEMBL7930604 0.88 GPR3 (0.30)
Bromide SCHEMBL7927972 0.88 GPR3 (0.30)
Syringol SCHEMBL7939638 0.77 GAA (0.31)
Hydrochloric Acid SCHEMBL5367425 0.76 NPC1 (0.31)
Hydrochloric Acid SCHEMBL7107646 0.76 MAPT (0.32) MAPT
Hydrochloric Acid SCHEMBL3674619 0.75
Hydrochloric Acid SCHEMBL1471143 0.74
Hydrochloric Acid SCHEMBL3041072 0.74 GPR3 (0.30)
Hydrochloric Acid SCHEMBL3037838 0.74 GPR3 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0730003-B1 Polypropylene resin composition and molded product TOSOH CORP (JP) 1997-12-29 EP disclosed
US-5608008-A ETHYLENE-A-OLEFIN COPOLYMER ELASTOMER TOSOH CORPORATION (JP) 1997-03-04 US disclosed
EP-0730003-A1 Polypropylene resin composition and molded product Tosoh Corporation (JP) 1996-09-04 EP disclosed