SCHEMBL890323

SCHEMBL890323

C=CC(=O)OCC=COC(=O)c1ccccc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.45
TDP1 Q9NUW8 2/20 0.41
AKT1 P31749 2/20 0.41
MAPK1 P28482 1/20 0.40
HIF1A Q16665 1/20 0.40
SLC6A2 P23975 1/20 0.40
SLC6A3 Q01959 1/20 0.40
KMT2A Q03164 1/20 0.40
ALDH1A1 P00352 3/20 0.39
LMNA P02545 2/20 0.39
CYP3A4 P08684 1/20 0.39
F2 P00734 1/20 0.39
TSHR P16473 3/20 0.37
CYP1A2 P05177 1/20 0.37
CYP2C9 P11712 1/20 0.37
CYP2C19 P33261 1/20 0.37
TK1 P04183 1/20 0.36
KDM4E B2RXH2 1/20 0.36
GAA P10253 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6673183 0.82 LMNA (0.45) TDP1AKT1MAPK1HIF1ASLC6A2
SCHEMBL6673178 0.82 LMNA (0.45) TDP1AKT1MAPK1HIF1ASLC6A2
SCHEMBL300000 0.78 THRB (0.55) THRBAKT1HIF1AKMT2AALDH1A1
SCHEMBL5351140 0.77 LMNA (0.47) TDP1AKT1MAPK1HIF1ASLC6A2
SCHEMBL15304539 0.76 LMNA (0.42) TDP1AKT1MAPK1HIF1ASLC6A2
SCHEMBL277924 0.76 TSHR (0.45) THRBMAPK1HIF1AALDH1A1CYP3A4
SCHEMBL434163 0.76 THRB (0.65) THRBTDP1AKT1MAPK1HIF1A
SCHEMBL28358977 0.75 CYP3A4 (0.54) THRBTDP1MAPK1KMT2AALDH1A1
SCHEMBL17459752 0.75 LMNA (0.48) TDP1AKT1MAPK1HIF1ASLC6A2
SCHEMBL891181 0.74 MMP1 (0.51) THRBTDP1MAPK1KMT2AALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9012555-B2 UV-curable thermoformable dielectric for thermoformable circuits E I DU PONT DE NEMOURS AND COMPANY (US) 2015-04-21 US disclosed
US-20140350162-A1 UV-CURABLE THERMOFORMABLE DIELECTRIC FOR THERMOFORMABLE CIRCUITS E I DU PONT DE NEMOURS AND COMPANY (US) 2014-11-27 US disclosed
US-20140350161-A1 UV-CURABLE THERMOFORMABLE DIELECTRIC FOR THERMOFORMABLE CIRCUITS E I DU PONT DE NEMOURS AND COMPANY (US) 2014-11-27 US disclosed
EP-2571916-B1 UV-CURABLE POLYMER THICK FILM DIELECTRIC COMPOSITIONS WITH EXCELLENT ADHESION TO ITO DU PONT (US) 2014-09-17 EP disclosed
US-8329772-B2 UV-curable polymer thick film dielectric compositions with excellent adhesion to ITO E I DU PONT DE NEMOURS AND COMPANY (US) 2012-12-11 US disclosed
US-20110288197-A1 UV-CURABLE POLYMER THICK FILM DIELECTRIC COMPOSITIONS WITH EXCELLENT ADHESION TO ITO E. I. DU PONT DE NEMOURS AND COMPANY (US) 2011-11-24 US disclosed
EP-0264037-B1 UV-CURABLE DIELECTRIC COMPOSITIONS E.I. DU PONT DE NEMOURS AND COMPANY (US) 1993-01-20 EP disclosed
US-4902605-A Photoresist composition comprising cyclohexyleneoxyalkyl acrylates EASTMAN KODAK COMPANY (US) 1990-02-20 US disclosed
EP-0300203-A2 Photoresist composition comprising cyclohexyleneoxyalkyl acrylates EASTMAN KODAK COMPANY (a New Jersey corporation) (US) 1989-01-25 EP disclosed
US-4771085-A TALC AND-OR MICA DISPERSED IN ACRYLATED RUBBER MODIFIED EPOXY RESIN OLIGOMER, ACRYLATED POLYDIENE OLIGOMER AND ALKYL ACRYLATE E. I. DU PONT DE NEMOURS AND COMPANY (US) 1988-09-13 US disclosed
US-4767883-A PHOTORESISTS; FLEXIBILITY; LOW VISCOSITY, HIGH GLASS TRANSITION TEMPERATURE; CROSSLINKABLE EASTMAN KODAK COMPANY (US) 1988-08-30 US disclosed
EP-0264037-A2 UV-curable dielectric compositions E.I. DU PONT DE NEMOURS AND COMPANY (US) 1988-04-20 EP disclosed
US-4322490-A Photopolymerizable compositions featuring improved monomers EASTMAN KODAK COMPANY (US) 1982-03-30 US disclosed