Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA14 | Q9ULX7 | 3/20 | 0.46 |
| ▸ | CA12 | O43570 | 2/20 | 0.46 |
| ▸ | CA1 | P00915 | 2/20 | 0.46 |
| ▸ | CA2 | P00918 | 2/20 | 0.46 |
| ▸ | CA7 | P43166 | 2/20 | 0.46 |
| ▸ | CA9 | Q16790 | 2/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.45 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.45 |
| ▸ | ALOX15 | P16050 | 3/20 | 0.45 |
| ▸ | LMNA | P02545 | 2/20 | 0.45 |
| ▸ | TYR | P14679 | 2/20 | 0.45 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.45 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.45 |
| ▸ | MIF | P14174 | 1/20 | 0.45 |
| ▸ | HTT | P42858 | 1/20 | 0.45 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.45 |
| ▸ | ESR2 | Q92731 | 4/20 | 0.41 |
| ▸ | ESR1 | P03372 | 4/20 | 0.41 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.41 |
| ▸ | ESRRG | P62508 | 2/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2965024 | 0.86 | ALDH1A1 (0.56) | CA14CA12CA1CA2CA7 | |
| SCHEMBL5513401 | 0.77 | KIF11 (0.47) | CA14CA12CA1CA2CA7 | |
| SCHEMBL10933172 | 0.77 | CA14 (0.52) | CA14CA12CA1CA2CA7 | |
| SCHEMBL278382 | 0.76 | ALDH1A1 (0.54) | CA14CA12CA1CA2CA7 | |
| SCHEMBL29375548 | 0.76 | ALDH1A1 (0.54) | CA14CA12CA1CA2CA7 | |
| SCHEMBL29384482 | 0.74 | ALDH1A1 (0.64) | CA1CA2ALDH1A1HSD17B10ALOX15 | |
| SCHEMBL187806 | 0.74 | ALDH1A1 (0.64) | CA1CA2ALDH1A1HSD17B10ALOX15 | |
| SCHEMBL29616024 | 0.74 | ALOX15 (0.46) | ALDH1A1HSD17B10ALOX15LMNATYR | |
| SCHEMBL10839049 | 0.74 | TDP1 (0.54) | CA1ALDH1A1HSD17B10ALOX15LMNA | |
| SCHEMBL440099 | 0.74 | ALOX15 (0.46) | ALDH1A1HSD17B10ALOX15LMNATYR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2022064917-A1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD | 富士フイルム株式会社 | 2022-03-31 | — | — | WO | disclosed |
| WO-2022064933-A1 | METHOD FOR PRODUCING COMPOSITE PATTERN, RESIN COMPOSITION, METHOD FOR PRODUCING MULTILAYER BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-31 | — | — | WO | disclosed |
| WO-2022059621-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-24 | — | — | WO | disclosed |
| WO-2022050278-A1 | CURABLE RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, SEMICONDUCTOR DEVICE, AND PHOTOBASE GENERATOR | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022050135-A1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022045060-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| WO-2022045275-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, SEMICONDUCTOR DEVICE, AND COMPOUND | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| WO-2021261429-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, AND THERMOSETTING RESIN | 富士フイルム株式会社 | 2021-12-30 | — | — | WO | disclosed |
| WO-2021132578-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAYERED PRODUCT, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2021-07-01 | — | — | WO | disclosed |
| WO-2021085072-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, LAYERED BODY MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 富士フイルム株式会社 | 2021-05-06 | — | — | WO | disclosed |
| WO-2021039841-A1 | METHOD FOR PRODUCING CURED FILM, PHOTOCURABLE RESIN COMPOSITION, METHOD FOR PRODUCING LAMINATE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2021-03-04 | — | — | WO | disclosed |
| US-5633112-A | Photosensitive resin composition containing a carboxylic acid polymer, photoacid generator and secondary or tertiary aliphatic amine | HITACHI, LTD. (JP) | 1997-05-27 | — | — | US | disclosed |