SCHEMBL8980797

SCHEMBL8980797

O=C1NC(=O)c2c1cccc2C1=CC(=S)CC=C1

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 5/20 0.36
ALDH1A1 P00352 5/20 0.36
HPGD P15428 2/20 0.36
HSD17B10 Q99714 2/20 0.36
GAA P10253 1/20 0.36
GSK3B P49841 2/20 0.36
PARP1 P09874 5/20 0.35
MAPK10 P53779 1/20 0.34
GSK3A P49840 1/20 0.33
CDK5 Q00535 1/20 0.33
CDK5R1 Q15078 1/20 0.33
CASP3 P42574 4/20 0.33
CASP7 P55210 2/20 0.33
CASP2 P42575 1/20 0.33
CASP6 P55212 1/20 0.33
CASP8 Q14790 1/20 0.33
MEN1 O00255 2/20 0.31
POLB P06746 2/20 0.31
KMT2A Q03164 2/20 0.31
HTT P42858 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5951479 0.71 ACHE (0.44)
SCHEMBL16754925 0.71 GSK3B (0.62) KDM4EALDH1A1HPGDHSD17B10GAA
SCHEMBL5953044 0.68 ACHE (0.50)
SCHEMBL1499914 0.66 GSK3B (0.54) KDM4EALDH1A1HPGDHSD17B10GAA
SCHEMBL9360804 0.65
SCHEMBL6510808 0.64 GSK3B (0.52) KDM4EALDH1A1HPGDHSD17B10GAA
SCHEMBL9016868 0.63 GSK3B (0.50) KDM4EALDH1A1HPGDHSD17B10GAA
SCHEMBL135332 0.63 GSK3B (0.56) KDM4EALDH1A1HPGDHSD17B10GAA
SCHEMBL28129100 0.63 GSK3B (0.45) KDM4EALDH1A1HPGDHSD17B10GAA
SCHEMBL9561195 0.62 GSK3B (0.54) KDM4EALDH1A1HPGDHSD17B10GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119403840-A Photocurable composition, method for producing cured film, solid-state imaging element, image display device, and radical polymerization initiator 富士胶片株式会社 2025-02-07 CN disclosed
US-5494944-A BLEND OF MATERIAL POLYMERIZABLE BY FREE RADICAL CATALYSTAND AN IRON COMPOUND CIBA-GEIGY CORPORATION (US) 1996-02-27 US disclosed
US-5371115-A Having sensitizers, electron acceptors selected from peracids, hydroperoxides and quinones; photosensitive, photoresists CIBA-GEIGY CORPORATION (US) 1994-12-06 US disclosed
EP-0295211-B1 Photoresist composition CIBA GEIGY AG (CH) 1994-03-16 EP disclosed
US-5124233-A PHOTORESIST COMPOSITIONS CIBA-GEIGY CORPORATION (US) 1992-06-23 US disclosed
EP-0214103-B1 ADHESIVELY BONDED PHOTOSTRUCTURABLE POLYIMIDE FOIL CIBA-GEIGY AG (CH) 1990-06-27 EP disclosed
US-4935320-A Substrate, thermostable adhesive, self-supporting, photocrosslinkable polyimide film CIBA-GEIGY CORPORATION (US) 1990-06-19 US disclosed
EP-0295211-A2 Photoresist composition CIBA-GEIGY AG (CH) 1988-12-14 EP disclosed
US-4786569-A Adhesively bonded photostructurable polyimide film CIBA-GEIGY CORPORATION (US) 1988-11-22 US disclosed
EP-0153904-B1 PROCESS FOR THE PREPARATION OF A PROTECTION LAYER OR A RELIEF PATTERN CIBA-GEIGY AG (CH) 1988-09-14 EP disclosed
EP-0152377-B1 CURABLE COMPOSITIONS AND THEIR USE CIBA-GEIGY AG (CH) 1987-12-09 EP disclosed
EP-0214103-A2 Adhesively bonded photostructurable polyimide foil CIBA-GEIGY AG (CH) 1987-03-11 EP disclosed
US-4624912-A EXPOSURE TO ELECTRON OR ACTINIC RADIATION, THEN HEATING CIBA-GEIGY CORPORATION (US) 1986-11-25 US disclosed
EP-0153904-A2 Process for the preparation of a protection layer or a relief pattern CIBA-GEIGY AG (CH) 1985-09-04 EP disclosed
EP-0152377-A2 Curable compositions and their use CIBA-GEIGY AG (CH) 1985-08-21 EP disclosed