Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | CA1 | P00915 | 1/20 | 0.31 |
| ▸ | CA2 | P00918 | 1/20 | 0.31 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.30 |
| ▸ | CYP1B1 | Q16678 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15546400 | 0.86 | CA1 (0.38) | CA1CA2 | |
| SCHEMBL17107320 | 0.86 | ALDH1A1 (0.38) | ALDH1A1MAPT | |
| SCHEMBL9463504 | 0.86 | CA2 (0.46) | ALDH1A1MAPTCA1CA2 | |
| SCHEMBL2197474 | 0.86 | MAPT (0.42) | ALDH1A1MAPTCA1CA2CYP1A2 | |
| SCHEMBL2836022 | 0.86 | MAPT (0.44) | ALDH1A1MAPTCA1CA2 | |
| Water SCHEMBL11606809 | 0.84 | ALDH1A1 (0.45) | ALDH1A1MAPTCYP1A2 | |
| Benzene SCHEMBL28295973 | 0.84 | ALDH1A1 (0.45) | ALDH1A1MAPTCYP1A2 | |
| Water SCHEMBL11606806 | 0.84 | ALDH1A1 (0.45) | ALDH1A1MAPTCYP1A2 | |
| SCHEMBL11505592 | 0.84 | MAOA (0.41) | ALDH1A1MAPTCYP1A2 | |
| SCHEMBL8397321 | 0.84 | CYP1B1 (0.45) | ALDH1A1MAPTCA2CYP1B1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | claimed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | claimed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | claimed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | claimed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | claimed |
| CN-109206659-B | Method for continuously recovering carbon fibers and continuous carbon fiber recovery device | 陈亮广 | 2020-12-18 | — | — | CN | disclosed |
| CN-111107975-A | Resin composition, method for producing three-dimensional object using same, three-dimensional object, fitting for holding object, and industrial robot using same | 柯尼卡美能达株式会社 | 2020-05-05 | — | — | CN | disclosed |
| EP-0476589-B1 | Multi-layer wiring substrate and production thereof | HITACHI LTD (JP) | 1996-06-12 | — | — | EP | disclosed |
| EP-0476589-A2 | Multi-layer wiring substrate and production thereof | HITACHI, LTD. (JP) | 1992-03-25 | — | — | EP | disclosed |
| EP-0153603-B1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRODUCTION OF CURED PRODUCT | HITACHI, LTD. (JP) | 1992-01-02 | — | — | EP | disclosed |
| EP-0102052-B1 | HEAT-RESISTANT RESIN, THERMOSETTING COMPOSITION AFFORDING THE SAME AND PREPOLYMER THEREOF | HITACHI, LTD. (JP) | 1990-10-31 | — | — | EP | disclosed |
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | disclosed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | disclosed |
| EP-0153603-A2 | Thermosetting resin composition, cured product, and production of cured product | HITACHI, LTD. (JP) | 1985-09-04 | — | — | EP | disclosed |
| US-4486583-A | MOLDING MATERIALS, COATINGS | HITACHI, LTD. (JP) | 1984-12-04 | — | — | US | disclosed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | disclosed |
| EP-0123262-A2 | Resin encapsulated semiconductor device and process for producing the same | HITACHI, LTD. (JP) | 1984-10-31 | — | — | EP | disclosed |
| EP-0102052-A2 | Heat-resistant resin, thermosetting composition affording the same and prepolymer thereof | HITACHI, LTD. (JP) | 1984-03-07 | — | — | EP | disclosed |
| EP-0078039-A1 | Thermosetting resin composition, prepolymer thereof and cured article thereof | Hitachi, Ltd. (JP) | 1983-05-04 | — | — | EP | disclosed |
| US-4066577-A | HIGH MOLECULAR WEIGHT POLYTRIAZINES OF SOLUBLE POLYMERIC N-CYANO-ISOUREA ETHERS | BAYER AKTIENGESELLSCHAFT (DT) | 1978-01-03 | — | — | US | disclosed |