Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.41 |
| ▸ | GAA | P10253 | 3/20 | 0.41 |
| ▸ | MEN1 | O00255 | 3/20 | 0.41 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.41 |
| ▸ | MAPT | P10636 | 2/20 | 0.41 |
| ▸ | GLA | P06280 | 1/20 | 0.41 |
| ▸ | RECQL | P46063 | 1/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | HPGD | P15428 | 1/20 | 0.32 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | CDC25B | P30305 | 1/20 | 0.32 |
| ▸ | ATM | Q13315 | 1/20 | 0.32 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.32 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.31 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.31 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6768843 | 0.86 | ALDH1A1 (0.50) | KDM4EGAAMEN1KMT2AMAPT | |
| SCHEMBL31682387 | 0.86 | ALDH1A1 (0.50) | KDM4EGAAMEN1KMT2AMAPT | |
| SCHEMBL11050237 | 0.80 | TSHR (0.36) | KDM4EGAAHPGDTSHRHSD17B10 | |
| SCHEMBL4981713 | 0.75 | PABPC1 (0.32) | — | |
| SCHEMBL4981716 | 0.74 | ALDH1A1 (0.56) | KDM4EGAAMEN1KMT2AMAPT | |
| SCHEMBL11733937 | 0.72 | JAK2 (0.54) | MAPTALDH1A1CYP3A4HPGD | |
| SCHEMBL728547 | 0.70 | RAPGEF4 (0.40) | KDM4EGAAMEN1KMT2AMAPT | |
| SCHEMBL8872909 | 0.70 | MAPT (0.48) | KDM4EGAAMEN1KMT2AMAPT | |
| SCHEMBL6584880 | 0.70 | SIGMAR1 (0.36) | KDM4EHPGDTSHRHSD17B10 | |
| SCHEMBL3168133 | 0.70 | ALDH1A1 (0.43) | KDM4EMEN1KMT2AMAPTALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | claimed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | claimed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | claimed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | claimed |
| US-4486583-A | MOLDING MATERIALS, COATINGS | HITACHI, LTD. (JP) | 1984-12-04 | — | — | US | claimed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | claimed |
| EP-0476589-B1 | Multi-layer wiring substrate and production thereof | HITACHI LTD (JP) | 1996-06-12 | — | — | EP | disclosed |
| EP-0476589-A2 | Multi-layer wiring substrate and production thereof | HITACHI, LTD. (JP) | 1992-03-25 | — | — | EP | disclosed |
| EP-0153603-B1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRODUCTION OF CURED PRODUCT | HITACHI, LTD. (JP) | 1992-01-02 | — | — | EP | disclosed |
| EP-0102052-B1 | HEAT-RESISTANT RESIN, THERMOSETTING COMPOSITION AFFORDING THE SAME AND PREPOLYMER THEREOF | HITACHI, LTD. (JP) | 1990-10-31 | — | — | EP | disclosed |
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | disclosed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | disclosed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | disclosed |
| EP-0153603-A2 | Thermosetting resin composition, cured product, and production of cured product | HITACHI, LTD. (JP) | 1985-09-04 | — | — | EP | disclosed |
| US-4486583-A | MOLDING MATERIALS, COATINGS | HITACHI, LTD. (JP) | 1984-12-04 | — | — | US | disclosed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | disclosed |
| EP-0123262-A2 | Resin encapsulated semiconductor device and process for producing the same | HITACHI, LTD. (JP) | 1984-10-31 | — | — | EP | disclosed |
| EP-0102052-A2 | Heat-resistant resin, thermosetting composition affording the same and prepolymer thereof | HITACHI, LTD. (JP) | 1984-03-07 | — | — | EP | disclosed |
| EP-0078039-A1 | Thermosetting resin composition, prepolymer thereof and cured article thereof | Hitachi, Ltd. (JP) | 1983-05-04 | — | — | EP | disclosed |
| US-4066577-A | HIGH MOLECULAR WEIGHT POLYTRIAZINES OF SOLUBLE POLYMERIC N-CYANO-ISOUREA ETHERS | BAYER AKTIENGESELLSCHAFT (DT) | 1978-01-03 | — | — | US | disclosed |