Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11505453 | 0.81 | CYP19A1 (0.36) | ALDH1A1GAA | |
| SCHEMBL8985134 | 0.80 | ALDH1A1 (0.32) | ALDH1A1 | |
| SCHEMBL6158941 | 0.77 | ALDH1A1 (0.44) | ALDH1A1GAA | |
| SCHEMBL2197474 | 0.73 | MAPT (0.42) | ALDH1A1 | |
| SCHEMBL10879447 | 0.72 | ALDH1A1 (0.34) | ALDH1A1GAA | |
| SCHEMBL4987876 | 0.71 | RAB9A (0.49) | ALDH1A1GAA | |
| SCHEMBL3184610 | 0.70 | ESR1 (0.35) | ALDH1A1GAA | |
| SCHEMBL2836022 | 0.69 | MAPT (0.44) | ALDH1A1GAA | |
| SCHEMBL11231018 | 0.69 | TSHR (0.43) | ALDH1A1 | |
| SCHEMBL10804520 | 0.69 | ALDH1A1 (0.46) | ALDH1A1GAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | claimed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | claimed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | claimed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | claimed |
| US-4486583-A | MOLDING MATERIALS, COATINGS | HITACHI, LTD. (JP) | 1984-12-04 | — | — | US | claimed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | claimed |
| EP-0476589-B1 | Multi-layer wiring substrate and production thereof | HITACHI LTD (JP) | 1996-06-12 | — | — | EP | disclosed |
| EP-0476589-A2 | Multi-layer wiring substrate and production thereof | HITACHI, LTD. (JP) | 1992-03-25 | — | — | EP | disclosed |
| EP-0153603-B1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRODUCTION OF CURED PRODUCT | HITACHI, LTD. (JP) | 1992-01-02 | — | — | EP | disclosed |
| EP-0102052-B1 | HEAT-RESISTANT RESIN, THERMOSETTING COMPOSITION AFFORDING THE SAME AND PREPOLYMER THEREOF | HITACHI, LTD. (JP) | 1990-10-31 | — | — | EP | disclosed |
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | disclosed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | disclosed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | disclosed |
| EP-0078039-B1 | THERMOSETTING RESIN COMPOSITION, PREPOLYMER THEREOF AND CURED ARTICLE THEREOF | Hitachi, Ltd. (JP) | 1986-01-22 | — | — | EP | disclosed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | disclosed |
| EP-0153603-A2 | Thermosetting resin composition, cured product, and production of cured product | HITACHI, LTD. (JP) | 1985-09-04 | — | — | EP | disclosed |
| US-4486583-A | MOLDING MATERIALS, COATINGS | HITACHI, LTD. (JP) | 1984-12-04 | — | — | US | disclosed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | disclosed |
| EP-0123262-A2 | Resin encapsulated semiconductor device and process for producing the same | HITACHI, LTD. (JP) | 1984-10-31 | — | — | EP | disclosed |
| EP-0102052-A2 | Heat-resistant resin, thermosetting composition affording the same and prepolymer thereof | HITACHI, LTD. (JP) | 1984-03-07 | — | — | EP | disclosed |