SCHEMBL8992497

SCHEMBL8992497

C=Cc1ccc(C[SiH2]c2ccccc2)cc1

nearest known ligand 0.48

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.48
TSHR P16473 1/20 0.48
POLB P06746 1/20 0.37
CA1 P00915 1/20 0.35
CA2 P00918 1/20 0.35
PSMD14 O00487 1/20 0.35
LMNA P02545 1/20 0.35
CHRNB2 P17787 1/20 0.31
CHRNB4 P30926 1/20 0.31
CHRNA3 P32297 1/20 0.31
CHRNA7 P36544 1/20 0.31
CHRNA4 P43681 1/20 0.31
TDP1 Q9NUW8 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13169409 0.83 TSHR (0.39) ALDH1A1TSHRTDP1
SCHEMBL3683423 0.79 TSHR (0.46) ALDH1A1TSHRTDP1
SCHEMBL9650567 0.73 ALDH1A1 (0.48) ALDH1A1TSHRPOLBCA1CA2
SCHEMBL9806380 0.73 ALDH1A1 (0.59) ALDH1A1TSHRPOLBCA1CA2
SCHEMBL1562120 0.73 ALDH1A1 (0.59) ALDH1A1TSHRPOLBCA1CA2
SCHEMBL29253333 0.71 ALDH1A1 (0.50) ALDH1A1TSHRPOLBCA1CA2
Styrene SCHEMBL490169 0.71 ALDH1A1 (0.93) ALDH1A1TSHRPOLBLMNATDP1
SCHEMBL2498577 0.71 LTA4H (0.53) TSHRCA1CA2
SCHEMBL9650574 0.70 ALDH1A1 (0.45) ALDH1A1TSHRPOLBCA1CA2
Styrene SCHEMBL2831366 0.69 ALDH1A1 (0.61) ALDH1A1TSHRPOLBCA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5516871-A Diphenylsiloxane oligomers functionalized at both terminals and methods for the preparation thereof DOW CORNING ASIA, LTD. (JP) 1996-05-14 US claimed
US-5502229-A ENDCAPPING DOW CORNING ASIA, LTD. (JP) 1996-03-26 US claimed
US-5516871-A Diphenylsiloxane oligomers functionalized at both terminals and methods for the preparation thereof DOW CORNING ASIA, LTD. (JP) 1996-05-14 US disclosed
US-5502229-A ENDCAPPING DOW CORNING ASIA, LTD. (JP) 1996-03-26 US disclosed