SCHEMBL9015495

SCHEMBL9015495

CCCC(=O)OCCC(C)OC

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.42
ALDH1A1 P00352 2/20 0.41
MAPT P10636 2/20 0.37
ADRA2A P08913 1/20 0.36
ADRA1A P35348 1/20 0.36
DNM1 Q05193 1/20 0.36
CYP3A4 P08684 1/20 0.36
TSHR P16473 1/20 0.36
ATM Q13315 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
BLM P54132 1/20 0.35
HTR2C P28335 1/20 0.35
NAAA Q02083 1/20 0.34
LMNA P02545 1/20 0.34
ENPP2 Q13822 4/20 0.33
CHRNB2 P17787 1/20 0.33
CHRNB4 P30926 1/20 0.33
CHRNA3 P32297 1/20 0.33
CHRNA4 P43681 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29108048 0.89 DGKA (0.53) DGKAALDH1A1MAPTDNM1CYP3A4
SCHEMBL421384 0.85 DGKA (0.42) DGKAALDH1A1MAPTADRA2AADRA1A
SCHEMBL20581538 0.85 DGKA (0.42) DGKAALDH1A1MAPTADRA2AADRA1A
SCHEMBL28564997 0.85 ADRA2A (0.36) DGKAALDH1A1MAPTADRA2AADRA1A
SCHEMBL445613 0.84 NAAA (0.45) DGKAALDH1A1DNM1BLMNAAA
SCHEMBL1045729 0.83 ADRA2A (0.35) DGKAMAPTADRA2AADRA1ADNM1
SCHEMBL112594 0.82 DGKA (0.47) DGKAALDH1A1MAPTADRA2AADRA1A
SCHEMBL29074738 0.81 DGKA (0.40) DGKAALDH1A1MAPTADRA2AADRA1A
SCHEMBL9730121 0.81 ALDH1A1 (0.43) DGKAALDH1A1MAPTADRA2AADRA1A
SCHEMBL31182144 0.81 CYP19A1 (0.42) DGKAALDH1A1MAPTADRA2AADRA1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115268215-B Photosensitive polyimide resin composition, photosensitive polyimide film containing photosensitive polyimide resin composition and application of photosensitive polyimide film 吉林奥来德光电材料股份有限公司 2025-05-16 CN disclosed
CN-107003613-A Photoetching comprising the hydrolysable silanes with halogen-containing carboxylic acyloxy amido is with resist lower membrane formation composition 日产化学工业株式会社 2017-08-01 CN disclosed
US-9164196-B2 Photosensitive resin composition for a color filter and uses thereof CHI MEI CORPORATION (TW) 2015-10-20 US disclosed
CN-104871089-A Photosensitive resin composition, method for producing cured film, cured film, organic EL display device and liquid crystal display device FUJIFILM CORP 2015-08-26 CN disclosed
US-20130299755-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR A COLOR FILTER AND USES THEREOF CHI MEI CORPORATION (TW) 2013-11-14 US disclosed
EP-0744662-A2 Reflection-preventing film-forming composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1996-11-27 EP disclosed