SCHEMBL9066682

SCHEMBL9066682

C=C(C)C(=O)OC(C)CC[Si](O)([SiH3])c1ccccc1

nearest known ligand 0.37

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
MTNR1A P48039 2/20 0.34
MTNR1B P49286 2/20 0.34
ELANE P08246 1/20 0.34
ALDH1A1 P00352 3/20 0.33
HPGD P15428 3/20 0.32
MAPT P10636 2/20 0.31
LMNA P02545 1/20 0.31
SMN1; SMN2 Q16637 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31
TSHR P16473 2/20 0.31
MMP12 P39900 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3310217 0.86 MTNR1A (0.35) MTNR1AMTNR1BELANEALDH1A1HPGD
SCHEMBL3310442 0.82 TSHR (0.34) MTNR1AMTNR1BELANEALDH1A1HPGD
SCHEMBL3305043 0.80 ALDH1A1 (0.34) MTNR1AMTNR1BELANEALDH1A1HPGD
SCHEMBL3307216 0.78 ALDH1A1 (0.35) MTNR1AMTNR1BELANEALDH1A1LMNA
SCHEMBL15603389 0.75 ALDH1A1 (0.33) ALDH1A1MAPTLMNA
SCHEMBL15949718 0.75 TSHR (0.46) ALDH1A1HPGDSMN1; SMN2TSHRMMP12
SCHEMBL3681972 0.72 LMNA (0.47) ELANEALDH1A1HPGDLMNATSHR
SCHEMBL16594998 0.71 ALDH1A1 (0.40) MTNR1AMTNR1BELANEALDH1A1MAPT
SCHEMBL2540758 0.71 TSHR (0.50) ALDH1A1MAPTLMNASMN1; SMN2TSHR
SCHEMBL17891305 0.70 HPGD (0.41) MTNR1AMTNR1BELANEALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0358238-B1 Resin compositions and a method of curing the same KANSAI PAINT CO LTD (JP) 1996-06-05 EP disclosed
US-5492968-A CONTAINS A HIGH MOLECULAR WEIGHT COMPOUND CONTAINING HYDROXY AND EPOXY GROUPS, A SILANE COMPOUND AND A METAL CHELATE COMPOUND KANSAI PAINT COMPANY LIMITED (JP) 1996-02-20 US disclosed
EP-0687712-A2 Resin composition and a method of curing the same KANSAI PAINT CO., LTD. (JP) 1995-12-20 EP disclosed
EP-0682086-A2 Resin composition and a method of curing the same KANSAI PAINT CO., LTD. (JP) 1995-11-15 EP disclosed
EP-0681003-A2 Resin composition and a method of curing the same KANSAI PAINT CO., LTD. (JP) 1995-11-08 EP disclosed
US-5389727-A Low temperature curing, weatherproofing KANSAI PAINT COMPANY, LIMITED (JP) 1995-02-14 US disclosed
US-5284919-A Low temperature curing, waterproofing, acid resistance KANSAI PAINT COMPANY, LIMITED (JP) 1994-02-08 US disclosed
US-5026793-A Containing hydroxy, epoxy, and silane compounds with chelate compound containing aluminum, titanium, or zironium KANSAI PAINT COMPANY LIMITED (JP) 1991-06-25 US disclosed
EP-0358238-A2 Resin compositions and a method of curing the same KANSAI PAINT CO., LTD. (JP) 1990-03-14 EP disclosed