SCHEMBL9503616

SCHEMBL9503616

Cc1cc(O)c(Br)c(C)c1-c1c(C)c(Br)c(O)c(Br)c1C

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 6/20 0.36
KDM4E B2RXH2 5/20 0.36
KMT2A Q03164 3/20 0.36
MEN1 O00255 2/20 0.36
USP2 O75604 1/20 0.36
ALDH1A1 P00352 7/20 0.34
HPGD P15428 5/20 0.34
RECQL P46063 3/20 0.34
ALOX15 P16050 3/20 0.33
HIF1A Q16665 3/20 0.33
HSD17B10 Q99714 3/20 0.33
MAPK1 P28482 3/20 0.33
CYP1A2 P05177 2/20 0.33
CYP3A4 P08684 2/20 0.33
CYP2D6 P10635 2/20 0.33
CYP2C9 P11712 2/20 0.33
ALOX12 P18054 2/20 0.33
CYP2C19 P33261 2/20 0.33
G6PD P11413 1/20 0.33
PKM P14618 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9503901 0.79 ALDH1A1 (0.47) MAPTKDM4EKMT2AALDH1A1HPGD
SCHEMBL86951 0.78 CA1 (0.42) MAPTKDM4EKMT2AMEN1USP2
SCHEMBL31088765 0.75 ALDH1A1 (0.40) MAPTKDM4EKMT2AMEN1USP2
SCHEMBL7173958 0.75 ALDH1A1 (0.40) MAPTKDM4EKMT2AMEN1USP2
SCHEMBL6027776 0.73 CA1 (0.42) MAPTKDM4EKMT2AMEN1USP2
SCHEMBL3123767 0.73 PTPN1 (0.44) MAPTKDM4EKMT2AMEN1USP2
SCHEMBL25581857 0.71 ACHE (0.43) MAPTKDM4EKMT2AMEN1ALDH1A1
SCHEMBL4950394 0.71 MAPT (0.36) MAPTKDM4EKMT2AMEN1USP2
SCHEMBL11214731 0.70 PTPN1 (0.46) MAPTKDM4EKMT2AMEN1USP2
SCHEMBL23143192 0.70 ALDH1A1 (0.36) MAPTKDM4EKMT2AMEN1USP2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0260571-B1 HALOGENATED EPOXY RESINS AND ADVANCED RESINS PREPARED THEREFROM THE DOW CHEMICAL COMPANY (US) 1993-06-30 EP claimed
EP-0239784-B1 CURABLE COMPOSITIONS CONTAINING A POLYEPOXIDE AND A HALOGENATED BISPHENOL THE DOW CHEMICAL COMPANY (US) 1992-05-06 EP claimed
US-4895755-A ENCAPSULATION OF ELECTRONIC COMPONENTS THE DOW CHEMICAL COMPANY (US) 1990-01-23 US claimed
US-4783363-A ELECTRICAL LAMINATES THE DOW CHEMICAL COMPANY (US) 1988-11-08 US claimed
WO-1988002012-A1 HALOGENATED EPOXY RESINS AND ADVANCED RESINS PREPARED THEREFROM THE DOW CHEMICAL COMPANY (US) 1988-03-24 WO claimed
US-4727119-A HALOGEN ATOM IN META POSITION WITH RESPECT TO GLYCIDYL ETHER ENCAPSULATION ELECTRICAL COMPONENTS THE DOW CHEMICAL COMPANY (US) 1988-02-23 US claimed
EP-0260571-B1 HALOGENATED EPOXY RESINS AND ADVANCED RESINS PREPARED THEREFROM THE DOW CHEMICAL COMPANY (US) 1993-06-30 EP disclosed
EP-0239784-B1 CURABLE COMPOSITIONS CONTAINING A POLYEPOXIDE AND A HALOGENATED BISPHENOL THE DOW CHEMICAL COMPANY (US) 1992-05-06 EP disclosed
US-4895755-A ENCAPSULATION OF ELECTRONIC COMPONENTS THE DOW CHEMICAL COMPANY (US) 1990-01-23 US disclosed
WO-1988002012-A1 HALOGENATED EPOXY RESINS AND ADVANCED RESINS PREPARED THEREFROM THE DOW CHEMICAL COMPANY (US) 1988-03-24 WO disclosed
US-4727119-A HALOGEN ATOM IN META POSITION WITH RESPECT TO GLYCIDYL ETHER ENCAPSULATION ELECTRICAL COMPONENTS THE DOW CHEMICAL COMPANY (US) 1988-02-23 US disclosed