Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GRIN2D | O15399 | 2/20 | 0.31 |
| ▸ | GRIN3B | O60391 | 2/20 | 0.31 |
| ▸ | GRIA1 | P42261 | 2/20 | 0.31 |
| ▸ | GRIA2 | P42262 | 2/20 | 0.31 |
| ▸ | GRIA3 | P42263 | 2/20 | 0.31 |
| ▸ | GRIA4 | P48058 | 2/20 | 0.31 |
| ▸ | GRIN1 | Q05586 | 2/20 | 0.31 |
| ▸ | GRIN2A | Q12879 | 2/20 | 0.31 |
| ▸ | GRIN2B | Q13224 | 2/20 | 0.31 |
| ▸ | GRIN2C | Q14957 | 2/20 | 0.31 |
| ▸ | GRIN3A | Q8TCU5 | 2/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2580886 | 0.75 | THRB (0.40) | — | |
| SCHEMBL2575560 | 0.74 | POLB (0.37) | — | |
| SCHEMBL28337858 | 0.70 | OPRM1 (0.31) | — | |
| SCHEMBL810946 | 0.70 | — | — | |
| SCHEMBL16267796 | 0.69 | MAOA (0.33) | GRIN2DGRIN3BGRIA1GRIA2GRIA3 | |
| SCHEMBL11141358 | 0.68 | ALDH1A1 (0.33) | — | |
| SCHEMBL6004062 | 0.68 | SLC6A4 (0.30) | — | |
| SCHEMBL28138747 | 0.67 | — | — | |
| SCHEMBL296745 | 0.67 | — | — | |
| SCHEMBL689258 | 0.66 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240210827-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-06-27 | — | — | US | disclosed |
| EP-3674346-B1 | RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL CO (JP) | 2023-01-11 | — | — | EP | disclosed |
| US-11118012-B2 | Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed wiring board | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-09-14 | — | — | US | disclosed |
| US-10831101-B2 | Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2020-11-10 | — | — | US | disclosed |
| US-20200247954-A1 | RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2020-08-06 | — | — | US | disclosed |
| EP-3674346-A1 | RESIN COMPOSITION, PREPREG, METAL-FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2020-07-01 | — | — | EP | disclosed |
| US-20200103752-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND ELECTRONIC DEVICE USING THE SAME | SAMSUNG SDI CO., LTD. (KR) | 2020-04-02 | — | — | US | disclosed |
| CN-105938208-B | The method of device and the patterning photoresist layer including photoresist layer | 三星SDI株式会社 | 2019-11-19 | — | — | CN | disclosed |
| CN-110244515-A | Photosensitive polymer combination, photo-sensitive resin and electronic device using it | 三星SDI株式会社 | 2019-09-17 | — | — | CN | disclosed |
| US-20190278176-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING THE SAME AND ELECTRONIC DEVICE | SAMSUNG SDI CO., LTD. (KR) | 2019-09-12 | — | — | US | disclosed |
| US-7416822-B2 | Resin and resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2008-08-26 | — | — | US | disclosed |
| US-20080081294-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF CURED RELIEF PATTERN USING THE SAME AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2008-04-03 | — | — | US | disclosed |
| EP-1906246-A2 | Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device | FUJIFILM Corporation (JP) | 2008-04-02 | — | — | EP | disclosed |
| US-20070154843-A1 | Resin and resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2007-07-05 | — | — | US | disclosed |
| EP-1707588-A1 | RESIN AND RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2006-10-04 | — | — | EP | disclosed |
| EP-1037112-B1 | POSITIVE PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION AND PROCESS FOR PRODUCING THE SAME | TORAY INDUSTRIES (JP) | 2004-11-24 | — | — | EP | disclosed |
| US-20040170914-A1 | Positive-working photosensitive resin precursor composition | TOMIKAWA MASAO (JP) | 2004-09-02 | — | — | US | disclosed |
| US-6723484-B1 | POLYAMIDE CAPABLE OF FORMING POLYOXAZOLE OR POLYIMIDE; AND PHOTOACID GENERATOR | TORAY INDUSTRIES, INC. (JP) | 2004-04-20 | — | — | US | disclosed |
| EP-1037112-A1 | POSITIVE PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION AND PROCESS FOR PRODUCING THE SAME | TORAY INDUSTRIES, INC. (JP) | 2000-09-20 | — | — | EP | disclosed |
| US-5518864-A | PHOTOSENSITIVE, QUINONE DIAZIDE | KABUSHIKI KAISHA TOSHIBA (JP) | 1996-05-21 | — | — | US | disclosed |