Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.44 |
| ▸ | TSHR | P16473 | 1/20 | 0.34 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4647335 | 0.85 | ALDH1A1 (0.46) | ALDH1A1TSHRMAPK1SMN1; SMN2 | |
| SCHEMBL2523247 | 0.80 | — | — | |
| SCHEMBL27996469 | 0.79 | ALDH1A1 (0.47) | ALDH1A1TSHRMAPK1SMN1; SMN2TDP1 | |
| SCHEMBL4228820 | 0.76 | ALDH1A1 (0.47) | ALDH1A1TSHRMAPK1SMN1; SMN2TDP1 | |
| SCHEMBL27398551 | 0.75 | ALDH1A1 (0.50) | ALDH1A1TSHRMAPK1SMN1; SMN2TDP1 | |
| SCHEMBL7170116 | 0.72 | ALDH1A1 (0.60) | ALDH1A1TSHRMAPK1SMN1; SMN2TDP1 | |
| SCHEMBL25882446 | 0.71 | SMN1; SMN2 (0.59) | ALDH1A1TSHRMAPK1SMN1; SMN2TDP1 | |
| SCHEMBL9233242 | 0.70 | ALDH1A1 (0.35) | ALDH1A1 | |
| SCHEMBL13979522 | 0.69 | ALDH1A1 (0.61) | ALDH1A1TSHRMAPK1SMN1; SMN2TDP1 | |
| SCHEMBL6064313 | 0.67 | SMN1; SMN2 (0.45) | ALDH1A1TSHRMAPK1SMN1; SMN2TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 244 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111607227-B | Three-dimensional nano carbon/polyimide composite aerogel material and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2023-02-28 | — | — | CN | claimed |
| US-20090017518-A1 | provide controllable size, uniform diameter distribution, high magnetization, improved storage stability, and modified surface for targeting biomolecules for biomaterial separation and environmental analysis; core of polymerized of styrene and methylacrylic acid | INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE | 2009-01-15 | — | — | US | claimed |
| CN-101345113-A | Magnetic fine particles and method for producing same | IND TECH RES INST (CN) | 2009-01-14 | — | — | CN | claimed |
| US-4725635-A | MIXTURE OF POLYSILOXANES, EPOXY-CONTAINING ALKOXY SILANE AND SILICON FREE EPOXY COMPOUND; DISCOLORATION INHIBITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1988-02-16 | — | — | US | claimed |
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026100079-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2026-05-15 | — | — | WO | disclosed |
| WO-2026100734-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT | ＨＤマイクロシステムズ株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-02-05 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-20250370339-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-04 | — | — | US | disclosed |
| EP-0391447-A2 | Method for production of inorganic oxide particles | NIPPON SHOKUBAI KAGAKU KOGYO CO. LTD. (JP) | 1990-10-10 | — | — | EP | disclosed |
| EP-0391448-A2 | Method for production of powder of fine inorganic particles | NIPPON SHOKUBAI CO., LTD. (JP) | 1990-10-10 | — | — | EP | disclosed |
| EP-0150221-B1 | PACKING FOR USE IN SEPARATION | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1990-08-08 | — | — | EP | disclosed |
| EP-0355927-A2 | A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1990-02-28 | — | — | EP | disclosed |
| EP-0318469-A1 | Packing for use in resolution | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1989-05-31 | — | — | EP | disclosed |
| US-4627919-A | Resolving agent | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1986-12-09 | — | — | US | disclosed |
| US-4619984-A | MODIFIED SILICA GEL | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1986-10-28 | — | — | US | disclosed |
| EP-0150221-A1 | PACKING FOR USE IN SEPARATION | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1985-08-07 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | ALDH1A1 3316/4885TSHR 3312/4885MAPK1 2987/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | ALDH1A1 413/4885TSHR 2388/4885MAPK1 1924/4885 |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | RER1, ASIC1, FRG1 | ALDH1A1 2344/4885TSHR 1401/4885MAPK1 3625/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.