Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NPC1 | O15118 | 1/20 | 0.37 |
| ▸ | RAB9A | P51151 | 1/20 | 0.37 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | GLA | P06280 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8981580 | 0.85 | SMN1; SMN2 (0.42) | NPC1RAB9ASMN1; SMN2ALDH1A1GLA | |
| SCHEMBL23852179 | 0.85 | KCNH3 (0.40) | NPC1RAB9ASMN1; SMN2ALDH1A1GLA | |
| SCHEMBL175818 | 0.79 | NPC1 (0.56) | NPC1RAB9ASMN1; SMN2ALDH1A1 | |
| SCHEMBL21401818 | 0.79 | SMN1; SMN2 (0.39) | NPC1RAB9ASMN1; SMN2ALDH1A1 | |
| Water SCHEMBL28325020 | 0.78 | L3MBTL1 (0.40) | NPC1RAB9ASMN1; SMN2ALDH1A1 | |
| Water SCHEMBL44003 | 0.77 | NPC1 (0.35) | NPC1RAB9ASMN1; SMN2 | |
| SCHEMBL7535852 | 0.76 | LMNA (0.38) | NPC1RAB9ASMN1; SMN2ALDH1A1GLA | |
| SCHEMBL4271408 | 0.76 | L3MBTL1 (0.41) | NPC1RAB9ASMN1; SMN2ALDH1A1 | |
| SCHEMBL11702489 | 0.76 | RAB9A (0.37) | NPC1RAB9ASMN1; SMN2ALDH1A1 | |
| SCHEMBL244947 | 0.76 | MAPT (0.50) | NPC1RAB9ASMN1; SMN2ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110156957-B | Water-based epoxy curing agent and preparation method and application thereof | 上海骁鹏新材料科技有限公司 | 2020-11-17 | — | — | CN | claimed |
| CN-110156957-A | Aqueous epoxy curing agent and its preparation method and application | 上海骁鹏新材料科技有限公司 | 2019-08-23 | — | — | CN | claimed |
| CN-1816547-A | Oxazolidinone antibiotics and derivatives thereof | MERCK & CO INC (US) | 2006-08-09 | — | — | CN | claimed |
| CN-1816534-A | Oxazolidinone antibiotics and derivatives thereof | MERCK & CO INC (US) | 2006-08-09 | — | — | CN | claimed |
| CN-1816545-A | Cyclopropyl group substituted oxazolidinone antibiotics and derivatives thereof | MERCK & CO INC (US) | 2006-08-09 | — | — | CN | claimed |
| CN-105452349-B | Nanocomposites comprising silica nanoparticles and dispersants, composites, articles, and methods of making the same | 3M创新有限公司 | 2022-09-27 | — | — | CN | disclosed |
| CN-109890750-B | Curable resins comprising nanoparticles containing surface-bonded hydrophobically modified alkyl groups | 3M创新有限公司 | 2022-05-10 | — | — | CN | disclosed |
| CN-113646398-A | Structural adhesive tape with epoxide microcapsules | 3M创新有限公司 | 2021-11-12 | — | — | CN | disclosed |
| CN-113613775-A | Epoxide microcapsules with pickering emulsifiers | 3M创新有限公司 | 2021-11-05 | — | — | CN | disclosed |
| CN-107735427-B | Ammonium salt catalyzed benzoxazine polymerization | 3M创新有限公司 | 2021-06-04 | — | — | CN | disclosed |
| CN-110156957-B | Water-based epoxy curing agent and preparation method and application thereof | 上海骁鹏新材料科技有限公司 | 2020-11-17 | — | — | CN | disclosed |
| CN-110156957-A | Aqueous epoxy curing agent and its preparation method and application | 上海骁鹏新材料科技有限公司 | 2019-08-23 | — | — | CN | disclosed |
| CN-107112221-A | Dicing tape | 电化株式会社 | 2017-08-29 | — | — | CN | disclosed |
| CN-1816534-A | Oxazolidinone antibiotics and derivatives thereof | MERCK & CO INC (US) | 2006-08-09 | — | — | CN | disclosed |
| CN-1816545-A | Cyclopropyl group substituted oxazolidinone antibiotics and derivatives thereof | MERCK & CO INC (US) | 2006-08-09 | — | — | CN | disclosed |
| CN-1816547-A | Oxazolidinone antibiotics and derivatives thereof | MERCK & CO INC (US) | 2006-08-09 | — | — | CN | disclosed |
| US-5087314-A | Bonding materials with amine curable epoxy resin containing electroconductive particles of various shapes | HARRIS CORPORATION (US) | 1992-02-11 | — | — | US | disclosed |