SCHEMBL244947

SCHEMBL244947

Cc1ccc(NCC2CO2)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.50
HTT P42858 1/20 0.41
HPGD P15428 2/20 0.41
RAB9A P51151 5/20 0.40
ALDH1A1 P00352 4/20 0.40
NPC1 O15118 4/20 0.40
SMN1; SMN2 Q16637 2/20 0.40
TP53 P04637 1/20 0.39
MEN1 O00255 3/20 0.39
KMT2A Q03164 3/20 0.39
GAA P10253 2/20 0.39
L3MBTL1 Q9Y468 2/20 0.39
KDM4E B2RXH2 1/20 0.39
POLB P06746 1/20 0.39
HSP90AA1 P07900 1/20 0.39
HSP90AB1 P08238 1/20 0.39
THRB P10828 1/20 0.39
ALOX15 P16050 1/20 0.39
MAPK1 P28482 1/20 0.39
CASP1 P29466 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19487205 0.90 MAPT (0.41) MAPTHTTHPGDRAB9AALDH1A1
SCHEMBL8981580 0.89 SMN1; SMN2 (0.42) MAPTRAB9AALDH1A1NPC1SMN1; SMN2
SCHEMBL19487203 0.86 MMP1 (0.41) MAPTHTTHPGDRAB9AALDH1A1
SCHEMBL21401818 0.83 SMN1; SMN2 (0.39) MAPTHTTRAB9AALDH1A1NPC1
SCHEMBL11245003 0.80 KLK5 (0.34) MAPTHPGDRAB9AALDH1A1NPC1
SCHEMBL4271408 0.80 L3MBTL1 (0.41) MAPTHTTHPGDRAB9AALDH1A1
SCHEMBL7535852 0.80 LMNA (0.38) HTTHPGDRAB9AALDH1A1NPC1
SCHEMBL11702489 0.80 RAB9A (0.37) MAPTHTTHPGDRAB9AALDH1A1
SCHEMBL16641019 0.79 HPGD (0.51) MAPTHPGDRAB9AALDH1A1NPC1
SCHEMBL932900 0.79 HPGD (0.51) MAPTHPGDRAB9AALDH1A1NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 83 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0262891-B1 Resin composition of thermosetting resin and thermoplastic resin TOHO RAYON KK (JP) 1996-12-27 EP claimed
EP-0262891-A2 Resin composition of thermosetting resin and thermoplastic resin Toho Rayon Co., Ltd. (JP) 1988-04-06 EP claimed
EP-3746500-B1 PREPREG SHEETS AND PREPREG STACKS USEFUL FOR PREPARING LOW VOID CONTENT FIBER-REINFORCED COMPOSTITE MATERIALS TORAY INDUSTRIES (JP) 2026-04-15 EP disclosed
US-12516149-B2 Flame retardant epoxy resin composition TORAY INDUSTRIES, INC. (JP) 2026-01-06 US disclosed
US-12415921-B2 Epoxy resin composition and cured product thereof SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2025-09-16 US disclosed
US-20250282986-A1 HEAT CONDUCTION SHEET, HEAT DISSIPATING DEVICE, AND METHOD OF MANUFACTURING HEAT CONDUCTION SHEET RESONAC CORPORATION (JP) 2025-09-11 US disclosed
CN-119842247-A Preparation method of epoxy resin coated ultramarine pigment microcapsule 太原理工大学 2025-04-18 CN disclosed
US-20240101755-A1 FLAME RETARDANT EPOXY RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2024-03-28 US disclosed
US-20240093003-A1 FLAME RETARDANT COMPOSITION, PREPREG, AND FIBER REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2024-03-21 US disclosed
US-20230212385-A1 EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2023-07-06 US disclosed
CN-111699211-B Prepreg sheets and prepreg stacks useful for making low void content fiber reinforced composites 东丽株式会社 2023-04-11 CN disclosed
WO-2008076285-A1 D1364 BT SECONDARY COATING ON OPTICAL FIBER DSM IP ASSETS B.V. (NL) 2008-06-26 WO disclosed
US-20050230667-A1 Conductive adhesive and circuit using the same SUGANUMA, KATSUAKI (JP) 2005-10-20 US disclosed
EP-1541654-A1 CONDUCTIVE ADHESIVE AND CIRCUIT COMPRISING IT Namics Corporation (JP) 2005-06-15 EP disclosed
CN-1078905-C Adhesive resin composition and laminate thereof and production process of laminate SHOWA DENKO KK (JP) 2002-02-06 CN disclosed
EP-0262891-B1 Resin composition of thermosetting resin and thermoplastic resin TOHO RAYON KK (JP) 1996-12-27 EP disclosed
CN-1132775-A Adhesive resin composition and laminate thereof and production process of laminate SHOWA DENKO KK (JP) 1996-10-09 CN disclosed
EP-0412055-A2 Method for producing a block of material CIBA-GEIGY AG (CH) 1991-02-06 EP disclosed
US-4962162-A TOUGHNESS, IMPACT AND COMPRESSIVE STRENGTH TOHO RAYON CO., LTD. (JP) 1990-10-09 US disclosed
EP-0262891-A2 Resin composition of thermosetting resin and thermoplastic resin Toho Rayon Co., Ltd. (JP) 1988-04-06 EP disclosed