SCHEMBL9719358

SCHEMBL9719358

Nc1cccc(Cc2ccc(C(=O)c3cccc(N)c3)cc2)c1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PBRM1 Q86U86 1/20 0.64
LMNA P02545 2/20 0.55
NPC1 O15118 1/20 0.55
MITF O75030 1/20 0.55
POLB P06746 1/20 0.55
CA1 P00915 3/20 0.52
CA2 P00918 3/20 0.52
CA9 Q16790 3/20 0.52
PLA2G2A P14555 2/20 0.46
PLA2G10 O15496 1/20 0.46
ATM Q13315 1/20 0.44
TDP1 Q9NUW8 1/20 0.44
L3MBTL1 Q9Y468 1/20 0.44
CYP19A1 P11511 1/20 0.43
SRD5A2 P31213 2/20 0.42
PRSS1 P07477 1/20 0.42
PRSS2 P07478 1/20 0.42
PRSS3 P35030 1/20 0.42
MPO P05164 1/20 0.41
MEN1 O00255 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9719372 0.95 PBRM1 (0.70) PBRM1LMNANPC1MITFPOLB
SCHEMBL9719321 0.92 CYP19A1 (0.53) PBRM1LMNANPC1MITFPOLB
SCHEMBL9719354 0.92 PBRM1 (0.66) PBRM1LMNANPC1MITFPOLB
SCHEMBL29492473 0.84 PBRM1 (0.88) PBRM1LMNANPC1MITFPOLB
SCHEMBL9097509 0.84 PBRM1 (0.88) PBRM1LMNANPC1MITFPOLB
SCHEMBL203373 0.84 PBRM1 (0.88) PBRM1LMNANPC1MITFPOLB
SCHEMBL6866238 0.83 PLA2G2A (0.53) LMNACA1CA2CA9PLA2G2A
SCHEMBL23098254 0.83 ATM (0.61) PBRM1LMNACA1CA2CA9
SCHEMBL11865541 0.82 PBRM1 (0.66) PBRM1LMNANPC1MITFPOLB
SCHEMBL127545 0.81 PBRM1 (0.81) PBRM1LMNANPC1MITFPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5153277-A Curable mixture comprising amino group-containing unsaturated ester compound or amino resin or polyethers and epoxy compound , curing agent; heat resistance, workability, adhesiveness to reinforcing fibers, fatigue-resistance NIPPON SHOKUBAI KAGAKU KOGYO CO., LTD. (JP) 1992-10-06 US disclosed
US-5082598-A Thermosetting unsaturated ester, thiuram compound, crosslinking agent, copper compound NIPPON SHOKUBAI KAGAKU KOGYO CO., LTD. (JP) 1992-01-21 US disclosed
EP-0400226-A1 Resin composition NIPPON SHOKUBAI CO., LTD. (JP) 1990-12-05 EP disclosed
US-4837280-A ACRYLATE GROUP-CONTAINING POLYAROMATIC AMINE COMPOUNDS TO FORM THERMOSETTING RESINS; HEAT RESISTANCE NIPPON SHOKUBAI KAGAKU KOGYO CO., LTD. (JP) 1989-06-06 US disclosed