SCHEMBL9746512

SCHEMBL9746512

Nc1ccc(OC2(N)C=CC(C(=O)Nc3ccccc3)=CC2)cc1

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PRMT1 Q99873 2/20 0.36
RAB9A P51151 4/20 0.36
NPC1 O15118 2/20 0.36
TP53 P04637 2/20 0.36
SMN1; SMN2 Q16637 2/20 0.36
MEN1 O00255 4/20 0.35
KMT2A Q03164 4/20 0.35
LMNA P02545 3/20 0.35
TDP1 Q9NUW8 2/20 0.35
POLB P06746 1/20 0.35
PKM P14618 1/20 0.35
APEX1 P27695 1/20 0.35
MAPT P10636 3/20 0.35
PGR P06401 1/20 0.35
SETD7 Q8WTS6 1/20 0.34
GFER P55789 2/20 0.33
HDAC3 O15379 1/20 0.33
HDAC1 Q13547 1/20 0.33
HDAC2 Q92769 1/20 0.33
NCOR2 Q9Y618 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1413121 0.80 PTPN1 (0.44) RAB9ATP53SMN1; SMN2MEN1KMT2A
SCHEMBL10426993 0.79 PRMT1 (0.40) PRMT1RAB9AMEN1KMT2ALMNA
SCHEMBL19990156 0.77 METAP2 (0.31)
SCHEMBL30792557 0.74 SRD5A2 (0.36) NPC1MEN1KMT2APOLBGAA
SCHEMBL29191329 0.74 ALDH1A1 (0.35) NPC1MEN1KMT2ALMNATDP1
SCHEMBL10339864 0.73 RAB9A (0.41) RAB9ATP53SMN1; SMN2MEN1KMT2A
SCHEMBL11219968 0.72 RAB9A (0.41) RAB9ATP53SMN1; SMN2MEN1KMT2A
SCHEMBL27495602 0.71 POLB (0.41) RAB9ANPC1TP53SMN1; SMN2MEN1
SCHEMBL28669837 0.70 MGLL (0.37) RAB9ATDP1MAPT
SCHEMBL1480399 0.69 MAOA (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5112989-A Process for producing unsaturated mono and dicarboxylic acid imide compound MATSUSHITA ELECTRIC WORKS LTD. (JP) 1992-05-12 US disclosed
US-4830819-A Composition for fixing metal powder molding at sintering NITTO DENKO CORPORATION (JP) 1989-05-16 US disclosed
EP-0172274-B1 A METHOD FOR PREPARING POLYIMIDE PREPOLYMERS TORAY INDUSTRIES, INC. (JP) 1989-05-10 EP disclosed
EP-0160558-A2 Polyimide composition for fixing metallic sheets NITTO DENKO CORPORATION (JP) 1985-11-06 EP disclosed
US-4539392-A Method of preparing polyimide prepolymer from ethylenically unsaturated dicarboxylic acid compound TORAY INDUSTRIES, INC. (JP) 1985-09-03 US disclosed
US-4362863-A Process for production of polyimide resins NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) 1982-12-07 US disclosed