SCHEMBL9750602

SCHEMBL9750602

C=C(C)C(=O)NCOCc1ccccc1

nearest known ligand 0.47

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.47
KDM4E B2RXH2 1/20 0.47
SMN1; SMN2 Q16637 5/20 0.46
LMNA P02545 1/20 0.46
HTT P42858 1/20 0.46
TSHR P16473 1/20 0.44
BRD4 O60885 1/20 0.41
MAOB P27338 1/20 0.41
NPC1 O15118 1/20 0.40
RAB9A P51151 1/20 0.40
HPGD P15428 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12020950 0.83 SMN1; SMN2 (0.57) ALDH1A1KDM4ESMN1; SMN2LMNAHTT
Methacrylic Acid SCHEMBL30425451 0.79 TSHR (0.60) ALDH1A1KDM4ESMN1; SMN2LMNAHTT
SCHEMBL10627496 0.79 TSHR (0.54) ALDH1A1SMN1; SMN2LMNAHTTTSHR
SCHEMBL183463 0.78 ALDH1A1 (0.59) ALDH1A1KDM4ESMN1; SMN2HPGD
SCHEMBL1027989 0.77 MTNR1A (0.51) ALDH1A1KDM4ESMN1; SMN2TSHRNPC1
SCHEMBL6495350 0.77 RAB9A (0.49) ALDH1A1SMN1; SMN2LMNAHTTTSHR
SCHEMBL771707 0.77 NPC1 (0.57) ALDH1A1KDM4EBRD4MAOBNPC1
SCHEMBL2346839 0.76 ALDH1A1 (0.40) ALDH1A1KDM4ETSHR
SCHEMBL11408222 0.76 TSHR (0.50) ALDH1A1SMN1; SMN2LMNAHTTTSHR
SCHEMBL11419619 0.76 TSHR (0.50) ALDH1A1KDM4ESMN1; SMN2LMNAHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4996132-A Heat-resistant photosensitive resin composition TOYKO OHKA KOGYO CO. LTD. (JP) 1991-02-26 US claimed
EP-0280295-A2 A heat-resistant photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 1988-08-31 EP claimed
US-4996132-A Heat-resistant photosensitive resin composition TOYKO OHKA KOGYO CO. LTD. (JP) 1991-02-26 US disclosed
EP-0280295-A2 A heat-resistant photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 1988-08-31 EP disclosed